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Peregrine Semiconductor and Soitec announce new bonded silicon-on-sapphire substrate for RFIC manufacturing
December 08, 2010 // Jean-Pierre Joosting
Peregrine Semiconductor and Soitec have announced the joint development and ramp in production of a new, bonded silicon-on-sapphire (SOS) substrate which has been qualified for use in manufacturing Peregrine's next-generation STeP5 UltraCMOS™ RF IC semiconductors.
This announcement marks an achievement for both companies in the evolution of bonded SOS wafers. Soitec’s core direct wafer-bonding technologies and state-of-the art industrial know-how combined with Peregrine’s legacy SOS process development and IC design expertise enabled the rapid development of a tuned substrate that delivers leading-edge RF performance required by the ever-advancing mobile wireless and industrial markets.
The new substrate is a bonded monocrystalline SOS substrate jointly engineered by the two companies. Soitec’s process expertise and direct wafer-bonding technologies were utilized to transfer and bond a high-quality, monocrystalline thin silicon layer onto a sapphire substrate. The resulting bonded silicon layer offers impressive improvements in transistor mobility and silicon quality beyond conventional SOS wafers which utilize an epitaxially grown silicon layer.
The new substrate provides Peregrine an ideal design landscape for enhancements in RFIC performance, functionality, and form factor, enabling IC size reduction and performance increase by as much as 30 percent. It also enables Peregrine to continue its long-term strategy toward highly integrated RF Front-End (RFFE) IC solutions in a substrate technology that matches the yield and scalability qualities of bulk silicon technologies.
For further information: www.psemi.com, www.soitec.com.
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Check out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
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The SoCKIT evaluation kit is Arrow's latest development tool, featuring an Altera Cyclone V SoC with a dual-core ARM Cortex-A9 MPCore processor integrated within its 28nm FPGA fabric.
Altera SoCs allow embedded system developers to differentiate their end product with customized hardware and software, and extend the product lifecycle through hardware and software updates in the field. This month, Arrow Electronics is giving away five SoCKIT evaluation kits featuring Altera’s ARM-Based SoCs, worth €249 each, together with the free entrance to one of Arrow’s SoC workshops organized throughout Europe.
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In our previous reader offer, Freescale Semiconductor was giving away five IMX6Q, Sabre-lite kits, worth £128.06 each.
Lucky winners include Mr. X. Salada Sole from the UK, Mrs A. Peric from Germany, Mr Z. Janosy from Hungary, Mr D. Gacina from Croatia and Mr B. Boris from France. All should be receiving their packages soon. Let's wish them some interesting findings with their projects.
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December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.
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