Peregrine Semiconductor and Soitec announce new bonded silicon-on-sapphire substrate for RFIC manufacturing
December 08, 2010 // Jean-Pierre Joosting
Peregrine Semiconductor and Soitec have announced the joint development and ramp in production of a new, bonded silicon-on-sapphire (SOS) substrate which has been qualified for use in manufacturing Peregrine's next-generation STeP5 UltraCMOS™ RF IC semiconductors.
This announcement marks an achievement for both companies in the evolution of bonded SOS wafers. Soitec’s core direct wafer-bonding technologies and state-of-the art industrial know-how combined with Peregrine’s legacy SOS process development and IC design expertise enabled the rapid development of a tuned substrate that delivers leading-edge RF performance required by the ever-advancing mobile wireless and industrial markets.
The new substrate is a bonded monocrystalline SOS substrate jointly engineered by the two companies. Soitec’s process expertise and direct wafer-bonding technologies were utilized to transfer and bond a high-quality, monocrystalline thin silicon layer onto a sapphire substrate. The resulting bonded silicon layer offers impressive improvements in transistor mobility and silicon quality beyond conventional SOS wafers which utilize an epitaxially grown silicon layer.
The new substrate provides Peregrine an ideal design landscape for enhancements in RFIC performance, functionality, and form factor, enabling IC size reduction and performance increase by as much as 30 percent. It also enables Peregrine to continue its long-term strategy toward highly integrated RF Front-End (RFFE) IC solutions in a substrate technology that matches the yield and scalability qualities of bulk silicon technologies.
For further information: www.psemi.com, www.soitec.com.
Private ID as a service leverages smartphone-enabled biometrics
November 26, 2015
Kicked-off in July last year, the PIDaaS (Private Identity as a Service) project aims to leverage today's smartphone sensors' ...
Like Micron, SK Hynix rejects Chinese advances
NXP, Freescale merger clears FTC hurdle
Thin film micro-lenses stretch to focus
Report: Abu Dhabi holding talks over GloFo sale
InvenSense to add PUF security to sensors
November 25, 2015
MEMS vendor InvenSense Inc. (San Jose, Calif.) has partnered with Intrinsic-ID BV (Eindhoven, The Netherlands) to develop ...
Flexible sensor detects multiple ions in fluids
Microsemi sees off Skyworks to win PMC-Sierra
Starting all over again on plastic: ARM
- Battery Size Matters
- Software-Defined Radio Handbook - 11th edition
- Multichemistry Buck Battery Charger Controller
- Automotive Circuit Protection using Littelfuse Automotive TVS Diodes
InterviewCEO interview: InvenSense's Abdi on expanding MEMS horizons
InvenSense Inc. is a MEMS company that has epitomized a fabless approach to a sector that is still highly reliant on a thorough grasp of the manufacturing and packaging processes. We interviewed CEO Behrooz ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, FTDI Chip is giving away six MCU development board packages complete with a dedicated compiler (including a full integrated development environment).
Worth Euro 315 each, the packages include a credit card sized Clicker 2 board for the FT90X 32-bit MCU supplied alongside a powerful dedicated compiler from MikroElektronika.
MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.