Replacement metal gate options for further transistor scaling
June 13, 2012 // Julien Happich
Imec is testing and evaluating various options for further transistor scaling using high-k dielectrics and metal gates in a replacement metal gate (RMG) integration schema.
Although RMG technology is inherently more complex than gate-first integration, it has a number of advantages that allow increasing the device performance and that widen the choices in terms of high-k and metal gate materials.
One of the current challenges to enable further device scaling is the choice of gate dielectric and gate electrode. For the selection of the gate electrode, the key parameters to consider are the work function, resistivity and compatibility with CMOS technology. Further scaling also requires continued improvement of the channel mobility, adding the options for improved stress management and also reliability control as a first-order consideration in the choice of materials and processes.
In the industry, the RMG approach is rapidly becoming the integration scheme of choice, and an alternative for the gate-first approach. In RMG, the high-k gate dielectric is deposited in the beginning of the flow or just prior to gate electrode deposition and the gate electrode is deposited after the formation of the junctions.
A clear advantage is the enhancement of the channel stress in shorter devices because of the dummy-gate removal, an intrinsic step in RMG flow. RMG also allows metal gate processes with a lower thermal-budget, which broadens the range of material options for work-function tuning and reliability control. Additional advantages are a lower gate resistance compared to gate-first, important for RF CMOS, and more room for mobility improvement.
With the eye on further scaling to sub-20nm technology nodes and in collaborating with the major tool suppliers, imec is now evaluating RMG technology for different applications, looking at different integration options, materials selection and engineering, and compatibility with advanced modules and device architectures.
This research is performed in cooperation with imec's key partners in its core CMOS programs Globalfoundries, INTEL, Micron, Panasonic, Samsung, TSMC, Elpida, SK hynix, Fujitsu and Sony.
Visit imec at www.imec.beAll news
RS Components and Allied Electronics connect with Rosenberger for global distribution
October 24, 2014
RS Components (RS) and Allied Electronics, the trading brands of Electrocomponents plc, have signed a global distribution ...
Pixel chip sparks energy-efficient intelligent LED headlamps
Noise cancellation: The sounds of silence in the car
HPLEDs double light output, cut costs by 40 percent
Startup creates virtual cores
Photochemical compounds for tunable OLED devices
October 24, 2014
Spanish researchers have developed new organic compounds characterized by a higher modularity, stability and efficiency, ...
Consumer chips in the car? Experts demand adequate design processes
Murata cheerleaders demonstrate sensors, swarm intelligence
Radon and VOCs detection goes personal
- 5 Best Practices for Designing Flexible Test Stations
- Intelligent PLCs Expand the Internet of Things
- Solutions for Millimeter Wave Wireless Backhaul
- Enter Linduino
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Oscium is giving away three of its iMSO-204L dual analogue iOS oscilloscopes, worth USD400 each. Designed with native Lightning compatibility, the iMSO-204L transforms the iPad, iPhone, and iPod touch into an ultra-portable, two-channel oscilloscope.
Since Apple changed its connector, Oscium has been working to bring native compatibility to its customers. The third generation...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.