Research consortium touts air-gap for PC boards
August 17, 2010 // R. Colin Johnson
The holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level, according to the Semiconductor Research Corp. (SRC), a technology research consortium based in Research Triangle Park, N.C.
"Continued improvements in computer performance require greater off-chip bandwidththat's the big bottleneck right now to building bigger systems," said Steve Hillenius, executive vice president at SRC. "These two advancements promise to increase the bandwidth of off-chip interconnects and enable those systems to be built."
Air-gap technology for chips was pioneered at IBM, where trenches are etched to provide the ultimate dielectricairto isolate signal lines from each other and the ground plane. Japan's Matsushita has also reported that it has air-gap technology for chips.
Georgia Tech, too, has done air-gap research for on-chip interconnections, but by using a MEMS-like sacrificial layer that is later removed after the copper wire is deposited. Now under a cooperative development agreement with SRC, Georgia Tech has repurposed its air-gap technology for printed circuit boards. The intellectual property for the technology is owned by Georgia Tech, but any SRC member has access to it for transfer to manufacturing. SRC members include AMD, IBM, Intel, Texas Instruments, Freescale and Global Foundries.
How's it work?
Air-gap technology for circuit boards adds an organic polycarbonate material to the layer of the PC board where the air gaps are supposed to reside. The whole surface of the PC board is coated with the polycarbonate, then heated, until it evaporates from everywhere except the copper traces. Later, after the rest of the PC board is assembled, the whole board is heated again to a higher temperature so that the organic polycarbonate evaporates from the copper traces, escaping as a vapor and leaving the air gaps behind.All news
Dark clouds over lighting business: Osram announces massive job cuts
July 30, 2014
Amidst the decline of conventional illuminants like incandescent bulbs and fluorescent tubes, lighting manufacturer Osram ...
Trillion Sensor Summit program set for Munich
IoT: sensor fusion or confusion?
Next-gen HiFi competition takes place in the car
Rohde & Schwarz acquires IT security company
Pure lithium anode promises more efficient rechargeable batteries
July 29, 2014
Researchers at Stanford University claim to have designed a pure lithium anode that could lead to the prospect of smaller, ...
Is a room temperature superconductor possible?
High-temperature superconductivity discovery paves way for energy superhighways
BMW invoke fast battery chargers to spark EV sales
- New Linear Regulators Solve Old Problems
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.