ROHM Semiconductor introduces ultra-compact high efficiency step-down DC/DC converter modules
February 04, 2011 // Paul Buckley
ROHM Semiconductor has introduced the BP5275 series of step-down DC/DC converter modules that integrate all required external components, including input/output capacitors, into a compact, high heat dissipation package. This makes them ideal for use as general-purpose power supplies in a variety of electronic devices.
Currently, multiple LDOs, switching regulators, and numerous other electrical components are essential in order to provide stable electrical power to internal circuits. However, the relatively large amount of heat generated by each component requires separate heat sinks or additional substrates to facilitate heat dissipation, making miniaturization difficult. Also, multiple tedious circuit design processes, including selection of external components based on phase compensation, FET voltage, and heat dissipation characteristics, are necessary, increasing development time and costs.
In response to this, the BP5275 series was developed, utilizing an in-house high-frequency (1.5 MHz) switching regulator IC and synchronous rectification system for high efficiency operation (93% for 6 V→5 V conversion). As a result, mounting area is reduced to 1/6th of the conventional size. The new high-heat-dissipation package enables direct heat dissipation from the device(s) to an aluminum heat sink. An external heat sink can be mounted, increasing output current capability to 800 mA. In addition, the 3-terminal, pin-compatible configuration enables major increases in power supply efficiency without requiring comprehensive modifications, reducing development time and costs.
The lineup including four types in different output voltages makes it possible to select the ideal solution based on the respective specifications. A high input voltage series is currently under development.
The BP5275 series is available in OEM quantities.
Visit ROHM Semiconductor at www.rohm.com/eu
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