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RS Components joins the mbed revolution

April 20, 2010 // Colin Holland

RS Components joins the mbed revolution

RS Components is strengthening its Embedded Development Platform (EDP) product line by signing a partnership with ARM and introducing an mbed module.


RS Components is strengthening its Embedded Development Platform (EDP) product line by signing a partnership with ARM and introducing an mbed module.

The mbed online platform for fast, low-risk prototyping of microcontroller-based systems was introduced by ARM and NXP in September 2009.

The website mbed.org and the mbed microcontroller rapid prototyping tools initially provided integral hardware and software support for the NXP LPC1768 ARM Cortex-M3 processor-based MCU and has now expanded to support the NXP LPC2368.

The RS EDP, first launched in June 2008, enables the rapid prototyping and proof-of-concept of embedded systems. It comprises reusable, reconfigurable personality and application modules, developed in-house to provide a variety of processing and I/O functions.

Following the partnership with ARM, RS will offer an mbed module for EDP allowing engineers to move, build and test their mbed designs in a hardware environment.

RS is also planning to introduce further modules for EDP and will use the platform as a key element in a major initiative to partner with universities and offer them cost-effective and powerful teaching aids.

While the initial RS mbed module is based on the NXP LPC1768 Cortex M3, EDP is designed to allow engineers to experiment with processors from competitive vendors on a common platform.  It is based on devices from a number of supplies including Infineon, NXP, Microchip and ST Microelectronics. Each module conforms to the EDP standard and can be fitted in any position, in any combination, in the two- or four-slotted EDP baseboards.

An mbed carrier module has been created to convert mbed form factor to EDP and all RS application modules now have mbed drivers. Third party modules are being adapted to significantly increase compliant module availability with drivers created for EDP and mbed platforms.

Additional EDP modules for wireless design such as RFID, GSM, and Wi-Fi have been commissioned and due to be available in third quarter of 2010 along with third party modules with sensors and LCD being released with corresponding EDP/mbed compliant drivers.

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