Sematech, SRC and SIA plan 3-D chip infrastructure
December 09, 2010 // Jean-Pierre Joosting
Sematech, SIA, and SRC have announced a program to drive industry standardization and the technical specifications for heterogeneous 3-D integration.
Sematech is the international consortium of leading semiconductor manufacturers, while the Semiconductor Research Consorium is active in collaborative research for the semiconductor industry. The Semicondcutor Industry Association is the leading representative of the semicondcutor industry's main players.
The new program will be administered by Sematech’s 3-D Interconnect program in partnership with SRC and be based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany
The program aims to establish the infrastructure necessary for the industry to leverage 3-D packaging technology for new applications and will focus on establishing standards in inspection, metrology, microbumping, bonding and thin wafer and die handling.
To achieve this Sematech will partner with SRC to enable select university research projects.
"The 3-D Enablement program has been established to bring down the barriers to integrating chips from different suppliers for adoption of 3-D technologies in high volume manufacturing," said Dan Armbrust, president and CEO of Sematech, in a statement.
While research on 3-D technologies has been ongoing for many years as witnessed by technical papers delivered at esteemed venues such as the International Electron Devices Meeting and the International Solid State Circuits Conference, 3-D has not yet made it to mainstream production due to lack of uniform standards and a limited understanding of key manufacturing parameters.
The program will address industry infrastructure gaps in phases. First efforts will focus on developing the necessary standards and technical specifications, followed by planning activities to identify the key areas for developing design tools to support 3-D chip design.
Designed to meet the needs of diverse business models, the 3-D Enablement program is open to international fabless, fab-lite and Integrated Device Manufacturers (IDM), outsourced assembly and test (OSAT) suppliers, and tool vendors.
Freescale opens Discovery Lab in Toulouse to foster innovation
September 17, 2014
Shortly after the company celebrated the first year of existence of its Austin-based Freescale Discovery Lab, an incubator ...
Can a large-area flexible OLED have reliable contacts?
Lemoptix pico-projector excels
Building ARM-based Bluetooth-enabled wearables
Asia-Pacific IC usage domination growing
Water-based nuclear battery generates electrical energy
September 17, 2014
Researchers at the University of Missouri have created a long-lasting and more efficient nuclear battery for the first time ...
Webinar: Insight into the WiFi-offload technology and lab testing
Belgium spin-off takes photonic IC design to the mainstream
Tablets to provide growth over flat PC market
- Flexible and Low Power Driving of Solenoid Coils
- How to Protect & Monetize Android Apps
- Power Modules: The New Super Power
- Flexible Performance for Network Security Appliances
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.