Sematech, SRC and SIA plan 3-D chip infrastructure
December 09, 2010 // Jean-Pierre Joosting
Sematech, SIA, and SRC have announced a program to drive industry standardization and the technical specifications for heterogeneous 3-D integration.
Sematech is the international consortium of leading semiconductor manufacturers, while the Semiconductor Research Consorium is active in collaborative research for the semiconductor industry. The Semicondcutor Industry Association is the leading representative of the semicondcutor industry's main players.
The new program will be administered by Sematech’s 3-D Interconnect program in partnership with SRC and be based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany
The program aims to establish the infrastructure necessary for the industry to leverage 3-D packaging technology for new applications and will focus on establishing standards in inspection, metrology, microbumping, bonding and thin wafer and die handling.
To achieve this Sematech will partner with SRC to enable select university research projects.
"The 3-D Enablement program has been established to bring down the barriers to integrating chips from different suppliers for adoption of 3-D technologies in high volume manufacturing," said Dan Armbrust, president and CEO of Sematech, in a statement.
While research on 3-D technologies has been ongoing for many years as witnessed by technical papers delivered at esteemed venues such as the International Electron Devices Meeting and the International Solid State Circuits Conference, 3-D has not yet made it to mainstream production due to lack of uniform standards and a limited understanding of key manufacturing parameters.
The program will address industry infrastructure gaps in phases. First efforts will focus on developing the necessary standards and technical specifications, followed by planning activities to identify the key areas for developing design tools to support 3-D chip design.
Designed to meet the needs of diverse business models, the 3-D Enablement program is open to international fabless, fab-lite and Integrated Device Manufacturers (IDM), outsourced assembly and test (OSAT) suppliers, and tool vendors.
RS Components and Allied Electronics connect with Rosenberger for global distribution
October 24, 2014
RS Components (RS) and Allied Electronics, the trading brands of Electrocomponents plc, have signed a global distribution ...
Pixel chip sparks energy-efficient intelligent LED headlamps
Noise cancellation: The sounds of silence in the car
HPLEDs double light output, cut costs by 40 percent
Startup creates virtual cores
Photochemical compounds for tunable OLED devices
October 24, 2014
Spanish researchers have developed new organic compounds characterized by a higher modularity, stability and efficiency, ...
Consumer chips in the car? Experts demand adequate design processes
Murata cheerleaders demonstrate sensors, swarm intelligence
Radon and VOCs detection goes personal
- 5 Best Practices for Designing Flexible Test Stations
- Intelligent PLCs Expand the Internet of Things
- Solutions for Millimeter Wave Wireless Backhaul
- Enter Linduino
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Oscium is giving away three of its iMSO-204L dual analogue iOS oscilloscopes, worth USD400 each. Designed with native Lightning compatibility, the iMSO-204L transforms the iPad, iPhone, and iPod touch into an ultra-portable, two-channel oscilloscope.
Since Apple changed its connector, Oscium has been working to bring native compatibility to its customers. The third generation...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.