Semicon preview: Startup, TSV tools to emerge
July 07, 2010 // Mark LaPedus
The Semicon West trade show starts next week, but the craze has already begun.
Applied, Lam, Novellus and others are readying new tools for use in emerging 3-D chip designs. Applied is expected to enter the MOCVD segment with a hybrid tool. Semicon West runs from July 13-15 in San Francisco, Calif.
At Semicon, the hot topics will include 3-D devices, LEDs, solar, and, of course, chip scaling. And unlike last year's event, the fab tool market is hot. IC-equipment sales are now expected to grow 96 percent in 2010, compared to 83 percent in the previous upgrade, according to VLSI Research Inc.
At Semicon, Applied Materials Inc. is expected to roll out its long-awaited, hybrid MOCVD tool. ''We believe that AMAT will formally announce a LED tool during Semicon. AMAT has been working with at least six vendors and has recognized revenue from at least one of the vendors, likely for its hydride vapor phase epitaxy tool,'' said C.J. Muse, an analyst with the Barclays Capital, in a recent report.
''AMAT is likely to introduce a cluster tool with 2 MOCVD + 1 HVPE tool, with the MOCVD tool still under development, but able to run demos. As a result of the timing though, AMAT is likely to miss the current boom that Aixtron and Veeco are enjoying related to LED backlighting application,'' Muse said. ''One of the features of the cluster tool is likely to be in-situ cleaning that would reduce potential defects in the active layer.''
Through-silicon-via (TSV) will be a hot topic at Semicon. Applied, Novellus and Lam will roll out products in the arena.
''Novellus is likely to release a solution that includes copper deposition (but a reactor that can handle higher amount of ECP), a conformal flow dielectric and Inova PVD,'' Muse said. ''Lam will possibly release a cheaper bulk etch solution for TSV. In addition Lam might also release cobalt tungsten phosphide product (not connected with TSV) based on Blue 29 purchase from KLA-Tencor.''All news
Google locks future wearable IP with smart lens patents
April 16, 2014
Yesterday, 15th of April, US-based Google fans were granted the privilege to exchange $1500 for a ďpairĒ of Google Glass. ...
Porsche connects infotainment to cloud with HTML5
Anglia signs with DEM Manufacturing
RFMW Ltd to distribute Aviacommís transceivers
Sensors, actuators market on 11% CAGR to 2018
Additional conference complements Sensor + Test trade fair
April 15, 2014
As an add-on to the Sensor + Test trade fair later this year in Nuremberg (Germany), the organizer plans to launch the European ...
End of Windows XP boosted 1Q14 PC sales, says Gartner
Global HB LED market set to shine by 2018
Chinese smartphone maker undercuts western companies
- USB 5V 2.5A Output, 42V Input Synchronous Buck with Cable Drop Compensation
- Measurement applications across multiple test platforms
- Supplying DC input power to string inverters
- Supplying DC input power for HEV testing
InterviewHeartbleed challenges the Internet of Thing
The Heartbleed security bug is a key example of the fundamental security challenge for the Internet of Things says Green Hills Software as it launches a new security group.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Arrow Electronics is giving away ten XMC1200 lighting application kits, worth 100 Euros each, for EETimes Europe's readers to win.
Each kit combines Infineon’s brightness and colour control XMC1200 CPU board to drive flicker free LED dimming and colour changing, together with a colour LED card and a white LED card.
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.