Si2 to form 3-D IC standards group
April 26, 2011 // Mark LaPedus
The Silicon Integration Initiative (Si2), an organization focused on the development and adoption of standards to improve IC design, is quietly forming a standards group for 3-D chips.
Over a dozen companies are interested in the effort, which hopes to devise standards for 3-D chips based on through-silicon vias (TSVs), according to Si2. Si2 is an organization of industry-leading companies in the semiconductor, electronic systems and EDA tool industries.
The plan is to have a ''kickoff meeting'' at the upcoming Design Automation Conference (DAC) In San Diego, the group said. DAC will be held June 5-9. The goal is to set the initial standards by Q1 of 2012.
Many wonder if mainstream 3-D chips based on TSV technology is feasible-or will even fly-amid ongoing problems in the arena. The progress remains slow and the technology still appears to be in the ''power point stage.
Still, a plethora of others are also scrambling to develop TSV-based technology-and for good reason: There are fears that IC scaling is becoming too costly for most chip makers-or will end in the distant future.
So instead of scaling, there is another concept on the table: stack and connect existing devices in a 3-D configuration using TSVs. For years, chip makers have been talking about 3-D chips based on TSVs. But except for select products-such as CMOS image sensors-the technology has not moved into the mainstream, due to costs, lack of standards and other factors.
In theory, 3-D chips could evolve in two steps. The first step is a 2.5-D scheme using silicon interposers. Then, eventually, the industry could move to 3-D TSV-if it can solve the multitude of problems with the technology.
In 3-D packaging, the lines blur between front-end manufacturing and packaging. However, many of the IC-packaging houses say have no plans to do the actual TSVs, that is, drilling and filling the holes. That, according to some, will be left up to the foundries. All news
ADCs for high dynamic range – successive-approximation or sigma-delta?
September 01, 2014
Maithil Pachchigar, an applications engineer with Analog Devices Inc., looks at trade-offs that must be considered when choosing ...
Microchip in Pursuit of CSR
Samsung Funds III-V FinFETs in US Lab
A question of Europe
Trinamic's stepper motor package gets you started
Winged parcel delivery: Google's way
August 29, 2014
While there is still debate about if legislation would ever allow swarms of commercial drones to fly over our heads, Google ...
Two-inch Super AMOLED display fits Samsung smartwatch plans
UK armed forces consider lithium sulfur batteries
Small cell market to hit $4.8 billion in five years
- Power Modules: The New Super Power
- Flexible Performance for Network Security Appliances
- Digital Power Management Reduces Energy Costs While Improving System Performance
- Using RF Recording Techniques to Resolve Interference Problems
InterviewA question of Europe
Sir Peter Bonfield sits on the board and has advisory roles in many international companies and universities. With more than 45 years of experience in electronics, computers and communications, here he ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.