Si2 to form 3-D IC standards group
April 26, 2011 // Mark LaPedus
The Silicon Integration Initiative (Si2), an organization focused on the development and adoption of standards to improve IC design, is quietly forming a standards group for 3-D chips.
Over a dozen companies are interested in the effort, which hopes to devise standards for 3-D chips based on through-silicon vias (TSVs), according to Si2. Si2 is an organization of industry-leading companies in the semiconductor, electronic systems and EDA tool industries.
The plan is to have a ''kickoff meeting'' at the upcoming Design Automation Conference (DAC) In San Diego, the group said. DAC will be held June 5-9. The goal is to set the initial standards by Q1 of 2012.
Many wonder if mainstream 3-D chips based on TSV technology is feasible-or will even fly-amid ongoing problems in the arena. The progress remains slow and the technology still appears to be in the ''power point stage.
Still, a plethora of others are also scrambling to develop TSV-based technology-and for good reason: There are fears that IC scaling is becoming too costly for most chip makers-or will end in the distant future.
So instead of scaling, there is another concept on the table: stack and connect existing devices in a 3-D configuration using TSVs. For years, chip makers have been talking about 3-D chips based on TSVs. But except for select products-such as CMOS image sensors-the technology has not moved into the mainstream, due to costs, lack of standards and other factors.
In theory, 3-D chips could evolve in two steps. The first step is a 2.5-D scheme using silicon interposers. Then, eventually, the industry could move to 3-D TSV-if it can solve the multitude of problems with the technology.
In 3-D packaging, the lines blur between front-end manufacturing and packaging. However, many of the IC-packaging houses say have no plans to do the actual TSVs, that is, drilling and filling the holes. That, according to some, will be left up to the foundries. All news
Conspiracy alleged over Rousset wafer fab closure
March 07, 2014
A class action lawsuit has been filed in Federal Court in New York alleging that Atmel Corp. (San Jose, Calif.) conspired ...
Europe loses PV market lead to Asia in 2013
Driverless car sharing concept focuses on digital comfort
Automated SSL test system authenticates LED technology performance
Paper-thin ultracapacitor aims to boost Li-ion battery performance
Apple set to transform sapphire wafer market
March 07, 2014
The sapphire industry ended an 18 month period of depressed pricing and achieved $936 million in revenue for wafer products ...
FTDI reveals streaming instruction behind new 32bit architecture
AMD taps UK tool for video verification
UHF RFID the radio technology of choice for Industry 4.0
- DSM presents: Select the best plastic for DDR4
- Wireless Sensor Network Challenges and Solutions
- Putting FPGAs to Work in Software Radio Systems Handbook
- Real-Time Spectrum Analysis for Troubleshooting 802.11n/ac WLAN Devices
InterviewWi-Fi is open for business, which is good news for mobile subscribers
Following the news that Netgear has built a Facebook-linked amenity Wi-Fi option into its routers, enabling businesses to offer free Wi-Fi in return for liking the company Facebook page, David Nowicki, ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Freescale is giving away ten RIoTboards, worth 74 dollars each, for EETimes Europe's readers to win.
Designed to run Android operating systems efficiently or to run under Linux, the board is based on the Freescale i.MX 6Solo processor; using the ARM Cortex-A9 architecture.
And the winner is...
In our previous reader offer, Crystal Display was giving...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.