Silicon-on-insulator at STM and IBM closing gap with Intel
April 17, 2012 // R. Colin Johnson
Silicon wafer maker Soitec S.A. claims that chip makers can sidestep years of development work needed to perfect fully-depleted (FD) silicon transistors by switching to its silicon-on-insulator (SOI) wafers, a ploy that has already convinced STMicroelectronics NV, ST-Ericsson and IBM Corp., to give it a try.
One of the biggest problems facing continued scaling of semiconductors below the 32-nanometer node is non-uniformities of dopants in the nanoscale-thin transistor-channel layer. To solve that problem, the industry is going to undoped channels for FD transistors. Intel has gone to great lengths to design FD undoped channels for its tri-gate FinFET transistor using standard bulk silicon wafers, which as a result requires sidewall implant doping to isolate the channel and prevent excess leakage current into the substrate.
Soitec has two flavors of its SOI wafers, one for traditional planar transistors that offers and ultra-thin top silicon layer with tollerances of plus or minus just five angstroms, for the FD transistor channels, atop an ultra-thin buried oxide layer that prevents leakage into the substrate without the extra process steps that Intel uses for its bulk-silicon process.
The second SOI wafer from Soitec is for 3-D FinFET transistors, such as those IBM has announced it will use at the 14-nm node. The 3-D SOI wafer has thicker top silicon layers for the tall 3-D fins and a thicker buried oxide layer to accommodate the higher fields produced by the multiple metal gates.
Both the 2-D planar and 3-D SOI wafers cost about four-times more than bulk siliconaccounting for Intel's reluctance to use them for its tri-gate FinFET process. But Soitec claims that the time gained in FD transistor development plus the fewer processing steps required when fabricating FD channels with sidewall implantation, more than makes up for the high price of the wafers.All news
Failed merger talks won't stop Dialog
July 23, 2014
AMS, formerly known as Austriamicrosystems, and Dialog Semiconductor couldn't agree the terms of a merger, which feels like ...
XCore architecture attracts Bosch investment
Steep growth for thermoelectric energy harvesting, says Infinergia Consulting
AMS, Dialog merger talks fail
MIT wrist-robot adds extra fingers
Li-ion batteries market for EVs to quadruple in a decade
July 22, 2014
Worldwide revenues from Li-ion batteries for all consumer EVs will grow from $5.7 billion in 2014 to $24.1 billion in 2023, ...
Monolithic Power Systems signs with Avnet Memec
Thoughts on energy harvesting for wearable equipment
Will laser ignition replace the venerable spark plug?
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
- Exploring the Business Model Evolution of High-Tech Equipment Manufacturers
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.