Sony curves images sensors; TSMC stacks them
April 08, 2014 // Peter Clarke
Two papers at an upcoming engineering conference promise to take image sensors new directions.
Image sensor market leader Sony Corp. is due to report on an improved CMOS image sensor that uses a curved substrate to improve the image fidelity and reduce the dark current. At the same event, the Symposium on VLSI Technology, which takes place June 9 to 12 at Honolulu, Hawaii, engineers from TSMC will report on CMOS image sensor with a 3D stacked architecture.
Sony's curved sensor is back side illuminated with the curvature matched to the curved depth of field that comes from an integrated lens that is close to the surface of the chip. The use of a flexed substrate doubles the light sensitivity at the edge of the image and increases it by a factor of 1.4, according to the abstract of the paper. This provides options to relax the lens design in terms of F number. At the same time the tensile stress of curving the substrate widens the energy band gap and thereby lowers the dark current.
TSMC's paper reports on replacing the conventional BSI carrier wafer with and ASIC wafer, which contains a part of periphery circuit and is connected to the sensor wafer through bonding technology. The engineers are due to report that with appropriate layout design and process control the impact of through-silicon-vias (TSVs) on the 1.1-micron BSI CMOS image sensor's performance can be minimized.
The abstract to paper 21.3 states that the stacked sensor exhibits comparable pixel performance to conventional BSI. It points out that this allows separate optimization of the sensor processes and should lead to improvement of dark current performance.
Related links and articles:
Design win; IDT meets IKEA
April 24, 2015
Integrated Device Technology, Inc. (IDT) has disclosed that IKEA has chosen IDT’s wireless power transmitters to embed in ...
Eurotech to offload its cloud offering to iNebula
Electric vehicles: Driving range decides
Samsung details its flex display
3D-printing aerogels for energy storage
Gartner lowers 2015 chip market growth forecast
April 23, 2015
A mix of currency shifts, excess inventory and the end a PC upgrade cycle is set to slow growth in the global semiconductor ...
Hexagon, Xylon join forces for smart CT-based quality control systems
PSA, IBM tie Connected Car to the Internet of Things
Disposable sensor patch analyses golfers' swing
- Smart Capacitive Design Tips
- Wireless MCUs and IoT
- Battery Management System Tutorial
- Deciding if Automated Test is right for your Company
InterviewInfineon: CAN FD success goes at the expense of FlexRay
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay. ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, DecaWave is offering EETimes Europe's readers the chance to win two TREK1000 kits to evaluate its Ultra-Wideband (UWB) indoor location and communication DW1000 chip in different real-time location system topologies.
Worth €947, the kit allow designers to prove a concept within hours and have a prototype ready in days. Based on the two-way ranging scheme, the kit lets you test...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.