Sony curves images sensors; TSMC stacks them
April 08, 2014 // Peter Clarke
Two papers at an upcoming engineering conference promise to take image sensors new directions.
Image sensor market leader Sony Corp. is due to report on an improved CMOS image sensor that uses a curved substrate to improve the image fidelity and reduce the dark current. At the same event, the Symposium on VLSI Technology, which takes place June 9 to 12 at Honolulu, Hawaii, engineers from TSMC will report on CMOS image sensor with a 3D stacked architecture.
Sony's curved sensor is back side illuminated with the curvature matched to the curved depth of field that comes from an integrated lens that is close to the surface of the chip. The use of a flexed substrate doubles the light sensitivity at the edge of the image and increases it by a factor of 1.4, according to the abstract of the paper. This provides options to relax the lens design in terms of F number. At the same time the tensile stress of curving the substrate widens the energy band gap and thereby lowers the dark current.
TSMC's paper reports on replacing the conventional BSI carrier wafer with and ASIC wafer, which contains a part of periphery circuit and is connected to the sensor wafer through bonding technology. The engineers are due to report that with appropriate layout design and process control the impact of through-silicon-vias (TSVs) on the 1.1-micron BSI CMOS image sensor's performance can be minimized.
The abstract to paper 21.3 states that the stacked sensor exhibits comparable pixel performance to conventional BSI. It points out that this allows separate optimization of the sensor processes and should lead to improvement of dark current performance.
Related links and articles:
Tower makes IR sensor for Intel RealSense
March 04, 2015
Foundry Tower Semiconductor Ltd., which trades as TowerJazz, has begun mass production of a near infrared light sensor used ...
Polymer blend improves solar cell efficiency by 200 percent
Stress tracker tames drivers
Glass coated cathode promises lithium-sulfur battery performance gains
Femtocell improves in-car mobile connectivity
Study: Autonomous driving changes cities and auto industry
March 03, 2015
The driverless car will have a disruptive effect on the automotive industry as we know it. A study from management consulting ...
Cisco, Deutsche Telekom and Intel to help IoT startups
Opinion: The NXP/Freescale takeover and automotive electronics
Parrot takes instant 3D mapping to the sky
- High Performance Portable DC Bench Power Supply: Save Money and Free Up Bench Real Estate by Building Your Own
- Software-Defined Radio Handbook
- A Four-Quadrant DC/DC Switching Regulator Smoothly Transitions from Positive to Negative Output Voltages for FPGA and Other Applications
- LED Driver with Integrated Spread Spectrum Reduces EMI without Adding Flicker
InterviewInfineon: CAN FD success goes at the expense of FlexRay
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay. ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
To ensure you have a good start in 2015, Freescale is giving away five of its QorIQ TWR-LS1021A Tower system modules, worth USD269 each, for EETimes Europe's readers to win.
The module is the most feature-rich and high-performance Tower system offered by Freescale, enabling compatibility and interoperability with the growing list of Tower expansion modules, offering an easily accessible...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.