Sony curves images sensors; TSMC stacks them
April 08, 2014 // Peter Clarke
Two papers at an upcoming engineering conference promise to take image sensors new directions.
Image sensor market leader Sony Corp. is due to report on an improved CMOS image sensor that uses a curved substrate to improve the image fidelity and reduce the dark current. At the same event, the Symposium on VLSI Technology, which takes place June 9 to 12 at Honolulu, Hawaii, engineers from TSMC will report on CMOS image sensor with a 3D stacked architecture.
Sony's curved sensor is back side illuminated with the curvature matched to the curved depth of field that comes from an integrated lens that is close to the surface of the chip. The use of a flexed substrate doubles the light sensitivity at the edge of the image and increases it by a factor of 1.4, according to the abstract of the paper. This provides options to relax the lens design in terms of F number. At the same time the tensile stress of curving the substrate widens the energy band gap and thereby lowers the dark current.
TSMC's paper reports on replacing the conventional BSI carrier wafer with and ASIC wafer, which contains a part of periphery circuit and is connected to the sensor wafer through bonding technology. The engineers are due to report that with appropriate layout design and process control the impact of through-silicon-vias (TSVs) on the 1.1-micron BSI CMOS image sensor's performance can be minimized.
The abstract to paper 21.3 states that the stacked sensor exhibits comparable pixel performance to conventional BSI. It points out that this allows separate optimization of the sensor processes and should lead to improvement of dark current performance.
Related links and articles:
ADCs for high dynamic range – successive-approximation or sigma-delta?
September 01, 2014
Maithil Pachchigar, an applications engineer with Analog Devices Inc., looks at trade-offs that must be considered when choosing ...
Microchip in Pursuit of CSR
Samsung Funds III-V FinFETs in US Lab
A question of Europe
Trinamic's stepper motor package gets you started
Winged parcel delivery: Google's way
August 29, 2014
While there is still debate about if legislation would ever allow swarms of commercial drones to fly over our heads, Google ...
Two-inch Super AMOLED display fits Samsung smartwatch plans
UK armed forces consider lithium sulfur batteries
Small cell market to hit $4.8 billion in five years
- Power Modules: The New Super Power
- Flexible Performance for Network Security Appliances
- Digital Power Management Reduces Energy Costs While Improving System Performance
- Using RF Recording Techniques to Resolve Interference Problems
InterviewA question of Europe
Sir Peter Bonfield sits on the board and has advisory roles in many international companies and universities. With more than 45 years of experience in electronics, computers and communications, here he ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.