Spring-contact battery connectors reduce cost of development
January 24, 2012 // Julien Happich
In increasing numbers of electronics development projects, cost-optimization efforts are focusing more closely on ensuring that different modules share as many identical or similar components as possible. This creates significant potential for savings – beginning with purchasing and storage and continuing through development and tool costs all the way to placement processes in volume production.
Plug-and-socket connectors, for example, frequently require only slight modifications in their mechanical dimensions – with no change to the electrical characteristics – to make them suitable for use in different applications. At volumes above certain minimum order levels, Suyin is able to make such application-specific modifications quickly and inexpensively in close collaboration with its customers.
One example of optimization of this type is the Series 200097MB four-position, right-angle SMT spring-contact battery connector, which was realized for a customer development project in two versions featuring different heights of 6.55 mm and 9.2 mm. In this way, the housing was adapted to perfectly match the specific application. In order to ensure excellent mating reliability, even when the devices are subjected to vibration loads, the spring contacts, with a pitch of 2.0 mm, feature a special design. The spring travel is specified at 1.6 mm and the contact force at greater than or equal to 165 g/contact. The dielectric strength is specified at 12 V / 2 A per contact and the number of mating cycles at a minimum of 6,500. Both versions of the spring contact battery connector are fitted with three SMT solder tabs (two side tabs and one tab at the back). Together with additional position-locking insertion tabs on the bottom of the connector, the solder tabs ensure a reliable and rugged mechanical connection to the PCB. Depending on the new development project, Suyin supplies connectors beginning at annual order volumes of 100,000 pieces or higher, and, of course, helps to ramp up the project with pre-series batches.
Visit Suyin at www.suyin-europe.com
Overcoming the challenges of V-NAND technology
October 22, 2014
For the past 40 years, conventional flash memory has been based on two-dimensional planar structures that make use of floating ...
Sensors for wearables market to double in 2015
IoT cybersecurity: is EDA ready to deliver?
InP circuits set 40Gbps wireless data record
Can Big-data solution free EVs from range anxiety?
Intel, IBM dueling 14nm FinFETS
October 22, 2014
Every digital semiconductor manufacturer and foundry in the world is trying to build 3D FinFETS that rival Intel, which is ...
Visteon concept marries data security and connectivity
Webinar covers ASIC design for MEMS
Utilities keen to own cellular networks
- 5 Best Practices for Designing Flexible Test Stations
- Intelligent PLCs Expand the Internet of Things
- Solutions for Millimeter Wave Wireless Backhaul
- Enter Linduino
InterviewCEO interview: AMS' Laney on driving a sensor-driven business
Kirk Laney, CEO of Austrian mixed-signal chip and sensor company AMS, wants to leverage the opportunity that technology affords to create new markets for sensors and sensor interfaces.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Oscium is giving away three of its iMSO-204L dual analogue iOS oscilloscopes, worth USD400 each. Designed with native Lightning compatibility, the iMSO-204L transforms the iPad, iPhone, and iPod touch into an ultra-portable, two-channel oscilloscope.
Since Apple changed its connector, Oscium has been working to bring native compatibility to its customers. The third generation...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.