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ST's share in Chinese wafer fab falling to 16.6%, says report

May 09, 2007 | | 199500076
STMicroelectronics' share in a chip-making joint-venture in Wuxi, China, with Hynix Semicondutor Inc., is set to reduce to 16.6 percent, according to a Xinhua Finance online report.
LONDON — STMicroelectronics' share in a chip-making joint-venture in Wuxi, China, with Hynix Semicondutor Inc., is set to reduce to 16.6 percent, according to a Xinhua Finance online report.

South Korean DRAM and flash memory maker Hynix has said it will invest an additional $250 million in Hynix-ST Semiconductor Ltd, a joint venture with STMicroelectronics NV. The report, which cited a Hynix regulatory filing as its source, said the money would be used to increase the capacity to manufacture memory chips there.

The report went on to say that the investment would take Hynix's total investment in the Chinese operation to $750 million and raise its stake in the venture to 83.3 percent. The report did not give a date for the investment to be made or completed.

Hynix-ST Semiconductor Ltd., which has been arranged such that ST holds one third and Hynix two thirds, has operated a 200-mm wafer fab for DRAMs at Wuxi for some time, and has completed commissioning a 300-mm wafer fab for making NAND flash memories.

ST is thought be in the process of moving most of its memory operations out into joint-ventures so that the company can focus on logic, mixed-signal and mixed-process circuits using a "fab-light" business model.

Related articles:

ST, Hynix prep 8-Gbit NAND flash entry

Hynix-ST fab venture ramps leading-edge ICs

Intel confirms $2.5 billion fab in China









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