Tabula confirms move to Intel's 22nm process featuring 3-D tri-gate transistors
February 22, 2012 // Julien Happich
Tabula confirmed previous speculation that it is implementing a family of 3PLD products manufactured by Intel using its advanced 22nm manufacturing process featuring 3-D Tri-Gate transistors and co-optimized packaging technology. This is made possible by a manufacturing access agreement between Tabula and Intel Custom Foundry, a division of the Technology and Manufacturing Group of Intel Corporation.
The 3PLD family will be based on Tabula's 3D Spacetime architecture and will deliver high-performance, cost-effective solutions for network infrastructure systems requiring high- bandwidth data flows such as Switches, Routers, Packet Inspection appliances, and other high-performance systems. The combination of process and architecture will allow Tabula to produce high-performance programmable circuits that consume significantly less chip area than circuits implemented with traditional FPGA fabrics.
At this weeks Ethernet Technology Summit, Daniel Gitlin, Tabulas Vice President of Manufacturing Technology, and a veteran in PLD advanced process technology, will discuss Tabulas approach to overcoming the limitations FPGA technologies have reached in supporting the explosive growth of bandwidth. The Summit will take place at the Doubletree hotel in San Jose, California. Mr. Gitlin will participate in the Ethernet Chipsets session (1-103), an executive panel discussion focusing on the latest advances in Ethernet technology, particularly in 40/100 GbE. The session starts at 3:10pm on Wednesday, February 22nd.
Intels revolutionary manufacturing technology breakthrough employing 3-D Tri-Gate transistors at the 22nm process node will provide our company with a head start of several years, much as Intel achieved in 2007 by introducing high-k metal-gate (HKMG) transistors at the 45nm node. said Daniel Gitlin. We believe this breakthrough will extend Tabulas Spacetime technology lead further beyond the rest of the programmable logic industry.All news
MEMS leaders under pressure, says Yole
July 31, 2014
The MEMS industry is changing as established leaders with manufacturing and an emphasis on delivering components are put ...
Panasonic and Tesla Gigafactory battery plan forges ahead
Surface inspection tool can get customized
Wireless charging - a more cost-effective approach
Sony, Panasonic, Japan Display plan OLED joint venture
Sony, TSMC win award for silicon-plastic process development
July 30, 2014
The American Association for Clinical Chemistry (AACC) has awarded Sony DADC BioSciences and Taiwan Semiconductor Manufacturing ...
Sensor footprint evolution: Does size matter?
Memscap breaks even on rising Q2 revenue
GPS tracking devices to pass $3.5 billion in 2019
- New Linear Regulators Solve Old Problems
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.