Temporary bonding equipment market to surf on the growth of thin wafer manufacturing
June 15, 2011 // Julien Happich
According to a report on the thin wafer manufacturing equipment & material market from Yole Développement, the temporary bonding equipment market will grow 500% in value between 2011 and 2016. Many consumer applications will require the need for ultra-thin semiconductor wafers (down to 50µm). But as wafer thickness decreases from the traditional 500µm to 100µm and below, manufacturing challenges arise.
Indeed, ultra-thin wafers are less stable and more vulnerable to stresses, and die can be prone to breaking and warping—not only during grinding but also at subsequent processing steps. To address these challenges, as chip thickness is reduced, new processes including temporary bonding technologies will be required for handling such fragile wafers, specifically to support the wafer during back grinding and subsequent post-thinning processes. As tapes can no longer be used for ultra-thin wafers (main reasons are the non-uniformity of the tapes, adhesion and extreme flexibility), new wafer handling technologies have to be developed.
“We are at the very start of an impressive market growth for temporary bonding technology”, explains Dr. Eric Mounier, Project Manager at Yole Développement.
Many different approaches in development
Temporary bonding technologies are numerous with no clear winning scenario coming out today, and the research firm has identified at least six different technologies for wafer temporary bonding with carriers. Each one of these approaches might have subtle differences in terms of chemistry, carriers and other attributes. Along with these approaches came also temporary bonding without carrier and reconstituted wafer for Fan Out WLP. So, the total number of approaches is more than 10 as of today. But this market is still in infancy and no clear temporary bonding technology is emerging. Many companies are competing to propose the best approach to achieve low cost, high temperature resistance and resolve topography issues.
As temporary bonding is a multi-disciplinary technology, it implies mastering know-how in process, chemistry and an understanding of the final application requirements. As a consequence, there are numerous collaborations running between tool makers, chemical players and substrate suppliers. Some companies are mastering both process and chemistry (Nitto Denko, TOK or TEL), but for others, partnerships are necessary. Temporary bonding is definitively a multiple-applications market. This is why the market is expected to boom. Yole Développement estimates the total number of wafers requiring temporary wafer bonding will be more than 35M by 2016 (all wafer sizes). Main applications driving temporary bonding are Advanced Packaging applications (TSV, interposers and Fan Out WLP), Power Devices (IGBTs), RF Devices & LEDs.
By 2016, Yole Développement evaluates the wafer temporary bonding (WTB) market equipment value for wafer & panels to be $300M by 2016.
Visit Yole Developpement at www.yole.frAll news
Gold ink market to reach USD50 million in 2018, says IDTechEx Research
June 20, 2013
In 2013 the market size for gold ink for electronic and electrical applications is less than USD1 million - used mainly for ...
Extending data security to configurable SoCs
Optimized RF Silicon-On-Insulator (SOI) drives monolithic integration of multi-band radios
Fully certified FlexRay transceiver enables ESD robust in-vehicle communication
IoT will be next silver screen, says media exec
Hard drives to hit billion-dollar mark by 2017 in video-surveillance applications, says IHS
June 19, 2013
The market for hard disk drives (HDDs) used in video surveillance will hit the billion-dollar level in less than five years, ...
Li-ion energy storage technology helps make smart grid for Pellworm Island even smarter
Data Fusion: the next frontier of software integration
“Prototype to Production”, the new Digi-Key trademark
InterviewSilica moves to fast lane in Europe's LED market
In the booming market for LED lighting, electronics distributor Silica intends to lead the pack by offering technological excellence at application level. The company is currently planning to offer tailor-made ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
The SoCKIT evaluation kit is Arrow's latest development tool, featuring an Altera Cyclone V SoC with a dual-core ARM Cortex-A9 MPCore processor integrated within its 28nm FPGA fabric.
Altera SoCs allow embedded system developers to differentiate their end product with customized hardware and software, and extend the product lifecycle through hardware and software updates in the field. This month, Arrow Electronics is giving away five SoCKIT evaluation kits featuring Altera’s ARM-Based SoCs, worth €249 each, together with the free entrance to one of Arrow’s SoC workshops organized throughout Europe.
And the winners are...
In our previous reader offer, Freescale Semiconductor was giving away five IMX6Q, Sabre-lite kits, worth £128.06 each.
Lucky winners include Mr. X. Salada Sole from the UK, Mrs A. Peric from Germany, Mr Z. Janosy from Hungary, Mr D. Gacina from Croatia and Mr B. Boris from France. All should be receiving their packages soon. Let's wish them some interesting findings with their projects.
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.