Texas Instruments continues drive for the adoption of copper wire bonding technology
May 23, 2012 // Paul Buckley
Texas Instruments Incorporated claims to have shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products.
TI says the milestone underscores the company’s confidence in copper as a viable replacement to gold in its semiconductor product roadmaps, and the electronics industry’s acceptance of the technology, due to performance, quality and reliability benefits for a range of applications.
“While the rising and fluctuating cost of gold was an original driver for making the switch to copper, the technology’s overall advantages today are undeniable,” said Devan Iyer, director of Semiconductor Packaging in TI’s Technology & Manufacturing Group. “Copper wire bonding is delivering a performance boost to customers, and through TI’s flexible internal and external manufacturing, we are able to deliver production at the same or higher levels than gold.”
Wire bonding technology connects the silicon die pads and semiconductor package leads with thin wires. TI was an early leader in the pursuit, development and implementation of copper wire bonding technology as an alternative to gold. After several years of research, development and product qualifications, TI proved that copper wire bonding is a high volume production process across a wide variety of products with equal or better manufacturability compared to gold, and TI’s customers have benefitted from its differentiation. Copper provides superior electrical performance with 40 percent higher electrical conductivity, resulting in lower operating resistance. This, in turn, improves overall product performance in high-speed digital, high-current mixed signal, and power management applications.
TI began shipping copper wire in its products in 2008, making the company an industry leader in broad fan-out of the technology. Today, all seven of TI’s assembly and test (A/T) sites are running copper wire bonding production across a range of products and package types, including quad flat no lead (QFN) packages, ball grid array packages such as nFBGA and PBGA; package-on-package (PoP); QFPs; TQFPs; TSSOPs; SOICs; PDIPs and others.
More information on copper wire bonding benefits at www.ti.com/cuwire-pr-wp
ADCs for high dynamic range – successive-approximation or sigma-delta?
September 01, 2014
Maithil Pachchigar, an applications engineer with Analog Devices Inc., looks at trade-offs that must be considered when choosing ...
Microchip in Pursuit of CSR
Samsung Funds III-V FinFETs in US Lab
A question of Europe
Trinamic's stepper motor package gets you started
Winged parcel delivery: Google's way
August 29, 2014
While there is still debate about if legislation would ever allow swarms of commercial drones to fly over our heads, Google ...
Two-inch Super AMOLED display fits Samsung smartwatch plans
UK armed forces consider lithium sulfur batteries
Small cell market to hit $4.8 billion in five years
- Power Modules: The New Super Power
- Flexible Performance for Network Security Appliances
- Digital Power Management Reduces Energy Costs While Improving System Performance
- Using RF Recording Techniques to Resolve Interference Problems
InterviewA question of Europe
Sir Peter Bonfield sits on the board and has advisory roles in many international companies and universities. With more than 45 years of experience in electronics, computers and communications, here he ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Trinamic Motion Control is offering you to win one of four TMCM-1043 development kits for its highly integrated, NEMA 17-compatible TMCM-1043 stepDancer stepper motor module.
Offering designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping and other key parameters, the intuitive kits are custom designed and developed for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.