Texas Instruments continues drive for the adoption of copper wire bonding technology
May 23, 2012 // Paul Buckley
Texas Instruments Incorporated claims to have shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products.
TI says the milestone underscores the company’s confidence in copper as a viable replacement to gold in its semiconductor product roadmaps, and the electronics industry’s acceptance of the technology, due to performance, quality and reliability benefits for a range of applications.
“While the rising and fluctuating cost of gold was an original driver for making the switch to copper, the technology’s overall advantages today are undeniable,” said Devan Iyer, director of Semiconductor Packaging in TI’s Technology & Manufacturing Group. “Copper wire bonding is delivering a performance boost to customers, and through TI’s flexible internal and external manufacturing, we are able to deliver production at the same or higher levels than gold.”
Wire bonding technology connects the silicon die pads and semiconductor package leads with thin wires. TI was an early leader in the pursuit, development and implementation of copper wire bonding technology as an alternative to gold. After several years of research, development and product qualifications, TI proved that copper wire bonding is a high volume production process across a wide variety of products with equal or better manufacturability compared to gold, and TI’s customers have benefitted from its differentiation. Copper provides superior electrical performance with 40 percent higher electrical conductivity, resulting in lower operating resistance. This, in turn, improves overall product performance in high-speed digital, high-current mixed signal, and power management applications.
TI began shipping copper wire in its products in 2008, making the company an industry leader in broad fan-out of the technology. Today, all seven of TI’s assembly and test (A/T) sites are running copper wire bonding production across a range of products and package types, including quad flat no lead (QFN) packages, ball grid array packages such as nFBGA and PBGA; package-on-package (PoP); QFPs; TQFPs; TSSOPs; SOICs; PDIPs and others.
More information on copper wire bonding benefits at www.ti.com/cuwire-pr-wp
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Internet of Things (IoT) manufacturer Ciseco has launched the Raspberry Pi ‘Wireless Inventors Kit’ (RasWIK), featuring 88 pieces to provide everything a Pi owner needs to follow a series of step-by-step projects or to create their own wireless devices, without the need for configuration or even writing code.
RasWIK has been designed to be highly accessible, demystifying the dark art of wireless and enabling anyone with basic computing skills to begin building wireless devices with a Raspberry Pi. You can create anything from a simple traffic light, to a battery monitor, or even a temperature gauge that sends data to the Xively IoT cloud so billions can access the data.This month, Ciseco is giving away twelve Raspberry Pi Wireless Inventors kits, worth £49.99 each for EETimes Europe's readers to win.
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In our previous reader offer, Farsens was giving away five kits for EEtimes Europe readers to evaluate its FenixVortex, Kineo and X1 wireless, battery free sensor tags.
Lucky winners include Mr A. Neil from the UK, Mr. E. Delvaux from Belgium, Mr Lengal from the Czech Republic, Mr H. Bijlsma from the Netherlands, and Mr G. Pfaff from Germany. All should be receiving their packages soon. Lets wish them some interesting findings with their projects.
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