Texas Instruments continues drive for the adoption of copper wire bonding technology
May 23, 2012 // Paul Buckley
Texas Instruments Incorporated claims to have shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products.
TI says the milestone underscores the company’s confidence in copper as a viable replacement to gold in its semiconductor product roadmaps, and the electronics industry’s acceptance of the technology, due to performance, quality and reliability benefits for a range of applications.
“While the rising and fluctuating cost of gold was an original driver for making the switch to copper, the technology’s overall advantages today are undeniable,” said Devan Iyer, director of Semiconductor Packaging in TI’s Technology & Manufacturing Group. “Copper wire bonding is delivering a performance boost to customers, and through TI’s flexible internal and external manufacturing, we are able to deliver production at the same or higher levels than gold.”
Wire bonding technology connects the silicon die pads and semiconductor package leads with thin wires. TI was an early leader in the pursuit, development and implementation of copper wire bonding technology as an alternative to gold. After several years of research, development and product qualifications, TI proved that copper wire bonding is a high volume production process across a wide variety of products with equal or better manufacturability compared to gold, and TI’s customers have benefitted from its differentiation. Copper provides superior electrical performance with 40 percent higher electrical conductivity, resulting in lower operating resistance. This, in turn, improves overall product performance in high-speed digital, high-current mixed signal, and power management applications.
TI began shipping copper wire in its products in 2008, making the company an industry leader in broad fan-out of the technology. Today, all seven of TI’s assembly and test (A/T) sites are running copper wire bonding production across a range of products and package types, including quad flat no lead (QFN) packages, ball grid array packages such as nFBGA and PBGA; package-on-package (PoP); QFPs; TQFPs; TSSOPs; SOICs; PDIPs and others.
More information on copper wire bonding benefits at www.ti.com/cuwire-pr-wp
Flexible sensor detects multiple ions in fluids
November 24, 2015
Imec and Holst Centre have demonstrated a prototype of a single-chip electrochemical sensor for simultaneous detection of ...
Microsemi sees off Skyworks to win PMC-Sierra
Starting all over again on plastic: ARM
From electronics to maths and money madness
Analog IC market growth set to slow
Volkswagen deploys data glasses in series production
November 23, 2015
Following a three-month pilot project, Volkswagen has introduced the usage of 3D smart glasses as standard equipment for ...
Startup CircuitSeed wants to be the ARM of analogue
Imagination Technologies leverages kickstarter for IoT kit launch
Taiwan considers lifting China investment ban
- Battery Size Matters
- Software-Defined Radio Handbook - 11th edition
- Multichemistry Buck Battery Charger Controller
- Automotive Circuit Protection using Littelfuse Automotive TVS Diodes
InterviewCEO interview: InvenSense's Abdi on expanding MEMS horizons
InvenSense Inc. is a MEMS company that has epitomized a fabless approach to a sector that is still highly reliant on a thorough grasp of the manufacturing and packaging processes. We interviewed CEO Behrooz ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, FTDI Chip is giving away six MCU development board packages complete with a dedicated compiler (including a full integrated development environment).
Worth Euro 315 each, the packages include a credit card sized Clicker 2 board for the FT90X 32-bit MCU supplied alongside a powerful dedicated compiler from MikroElektronika.
MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.