Thin Film printed electronics targets smart packaging
July 12, 2012 // Peter Clarke
Bemis Company Inc., (Neenah, Wisconsin), a producer of films and packaging for the food and healthcare industries, is working with printed electronics pioneer Thin Film Electronics ASA (Oslo, Norway) to develop a flexible sensing film that can wirelessly communicate data.
Under the agreement with Bemis, Thinfilm will extend its work on a time-temperature sensor for use in monitoring perishable goods and pharmaceuticals. The result, due to be commercially available in 2014, will be packaging that can collect and wirelessly communicate sensor information, for use by leading food, consumer products and healthcare companies worldwide, Thin Film said.
"Our agreement with Thin Film represents an investment in a technology that could eventually make printed electronics a component of every package we manufacture," said Henry Theisen, CEO of Bemis, in a statement issued by Thin Film.
The flexible packaging market in North America is estimated to be worth $18.3 billion annually.
Mock up of RF sensor and tag for monitoring and reporting food freshness. Source: Thin Film Electronics.
Dark clouds over lighting business: Osram announces massive job cuts
July 30, 2014
Amidst the decline of conventional illuminants like incandescent bulbs and fluorescent tubes, lighting manufacturer Osram ...
Trillion Sensor Summit program set for Munich
IoT: sensor fusion or confusion?
Next-gen HiFi competition takes place in the car
Rohde & Schwarz acquires IT security company
Pure lithium anode promises more efficient rechargeable batteries
July 29, 2014
Researchers at Stanford University claim to have designed a pure lithium anode that could lead to the prospect of smaller, ...
Is a room temperature superconductor possible?
High-temperature superconductivity discovery paves way for energy superhighways
BMW invoke fast battery chargers to spark EV sales
- New Linear Regulators Solve Old Problems
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.