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TI Development kit for FRAM MCU from Farnell

TI Development kit for FRAM MCU from Farnell

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By eeNews Europe



This addition to the LaunchPad family, MSP-EXP430FR5969 is an evaluation module for the MSP4305969 microcontroller that enables developers to reduce energy budgets, minimise product size and enable a battery-free world.

Embedded FRAM, a non-volatile memory known for high endurance and high speed write access, together with ultra-low power makes the MSP430 suited for a wide variety of applications ranging from metering, wearable electronics, consumer electronics, the Internet of Things (IoT), industrial and remote sensors, home automation and energy harvesting.

Available in this dev kit, TI’s new EnergyTrace++ technology is the first debug system that enables developers to analyse power consumption down to 5 nA resolution in real-time for each peripheral; this allows engineers to take control of their power budget and optimise software to create the lowest energy product possible.

Features include :

  1. MSP430 ULP FRAM technology-based 16-bit MSP430FR5969 MCU;
  2. 64 kB FRAM / 2 kB SRAM;
  3. 16-bit RISC up to 8-MHz FRAM access / 16 MHz system clock speed;
  4. 5x timer blocks;
  5. Analogue: 16-ch 12-bit differential ADC, 16-ch comparator;
  6. Digital: AES256, CRC, DMA, HW MPY32;
  7. 20 pin LaunchPad standard using the BoosterPack ecosystem.

The evaluation kit comes with the essentials to get started fast, including on-board eZ-FET emulation for programming, debugging and energy measurements. The board features on-board buttons and LEDs for quick integration of a simple user interface as well as a SuperCap allowing standalone applications without an external power supply.

The Texas Instruments MSP-EXP430FR5969 is now available through Farnell element14 in Europe; www.premierfarnell.com

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