Toshiba and Sandisk to scrap 2D NAND fab for 300mm 3D NAND
May 22, 2014 // Julien Happich
Toshiba Corporation announced it will demolish its No. 2 semiconductor fabrication facility (Fab 2) at Yokkaichi Operations, a NAND Flash memory plant in Mie prefecture, Japan, to replace it with a new fab on the same site, dedicated to 3D NAND.
The company also entered into a non-binding memorandum of understanding with SanDisk Corporation to invest jointly in the new facility and secure space for converting existing Toshiba and SanDisk 2D NAND capacity to 3D NAND beginning in 2016.
The building of Fab2 which ended its 200mm wafer production in 2010, is currently used as an office building, and after its demolition (due to start this month), construction of a new fab should begin in September 2014, with a target completion date of Summer 2015.
Toshiba expects to begin mass production of 3D memory in the 2nd Half of FY2015, relying on existing equipments from nearby Fab3 and Fab4. The company will then transition to Fab2 to convert more 2D NAND capacity to 3D NAND as the clean room investments are finalized.
Although Toshiba's Bit Cost Scalable (BiCS) memory technology may have evolved since its first presentation in 2007, it is still under development and its full specifications are yet to be finalized. Late 2012, the company announced that it had 16-layer prototype devices based on a 50nm diameter vertical channel.
Toshiba's Bit Cost Scalable memory architecture.
Construction of the initial cleanroom is expected to be complete in time for 2016 output, with large-capacity products gradually shifting to 3D memory. But the company will keep some capacity for 2D memory to address market demand and will take further ramp up decisions on capacity conversion ramp and equipment investment from there.
The new fab will have a quake absorbing structure and an environmentally friendly design that includes LED lighting throughout the building. It will also be equipped with the latest energy saving manufacturing equipment, which will secure productivity advances while lowering power consumption. Highly efficient use of waste heat will help to lower fuel consumption and cut CO2 emissions by 15% compared to Fab 5, currently the most advanced fab on the Yokkaichi site.
Toshiba and SanDisk will, through joint ventures, maximize investment efficiency in the transition to 3D NAND by making full use of the Yokkaichi site. Going forward, the companies will continue to jointly develop advanced process technology, and make investments to meet market requirements.
Visit Toshiba Electronics Europe at www.toshiba-components.com
Related news:All news
MEMS leaders under pressure, says Yole
July 31, 2014
The MEMS industry is changing as established leaders with manufacturing and an emphasis on delivering components are put ...
Panasonic and Tesla Gigafactory battery plan forges ahead
Surface inspection tool can get customized
Wireless charging - a more cost-effective approach
Sony, Panasonic, Japan Display plan OLED joint venture
Sony, TSMC win award for silicon-plastic process development
July 30, 2014
The American Association for Clinical Chemistry (AACC) has awarded Sony DADC BioSciences and Taiwan Semiconductor Manufacturing ...
Sensor footprint evolution: Does size matter?
Memscap breaks even on rising Q2 revenue
GPS tracking devices to pass $3.5 billion in 2019
- New Linear Regulators Solve Old Problems
- Testing GPS with a Simulator
- DSM presents: Select the best plastic for DDR4
- Dual 13A μModule Regulator with Digital Interface for Remote Monitoring & Control of Power
InterviewCEO interview: China, not Apple, is way to go, says mCube CEO
Ben Lee, CEO of MEMS startup mCube, explains why he wants to spend $37 million on being a supplier of sensors to Chinese ODMs and avoiding a design win with Apple or Samsung.
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Altium Ltd is offering EETimes Europe's readers the chance to win one TASKING VX-Toolset for ARM Cortex-M Premium Edition, normally licensed for 2.395 Euros, for ultra-rapid prototyping and code development around ARM Cortex-M based microcontrollers.
The VX-toolset for ARM is the first TASKING compiler suite to receive the Software Platform technology, which is seamlessly...Read more
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.