TSMC announces 0.18-micron automotive grade embedded flash IP
May 27, 2010 // Julien Happich
Taiwan Semiconductor Manufacturing Company (TSMC) announced the 0.18-micron automotive Embedded Flash IP as its second generation Embedded Flash IP that passed AEC-Q100 product qualification requirements for a wide range of automotive applications. The 0.18-micron automotive Embedded Flash IP macro features 27 percent area reduction compared to an equivalent 0.25-micron design. The 0.18 micron technology generation hits a cost and performance sweet spot as vast amount of IPs have been developed for many applications.
The addition of this 0.18-micron automotive qualified Embedded Flash IP enables customers to extend their current 0.18-micron product portfolios to automotive micro-controller applications.
The 0.18-micron automotive Embedded Flash process entered initial volume production last year. More than 38000 8-inch wafers or an equivalent number of 43 Million automotive MCU units have been shipped. So far TSMC had observed lower failure rate as compared to the previous generation 0.25 um in which 0.1ppm or less has been achieved.
Much of the learning in bringing the 0.25-micron Embedded Flash technology to production readiness has also resulted in a quicker time in achieving this new record for the new IP.
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