TSMC to invest $1.4 billion in ASML
August 06, 2012 // Peter Clarke
Leading foundry TSMC has opted to take a 5 percent stake in Dutch lithography equipment maker ASML as part of an equity-plus-research funding program. Intel has already opted to take a 15 percent stake in ASML.
TSMC is paying 838 million euro (about $1.04 billion) to acquire its stake in ASML and has committed to contribute 276 million euro (about $340 million), spread over 5 years, to ASML's research and development programs.
TSMC's move follows a similar one by Intel that saw the world's largest chip company agree to acquire a 15 percent stake in ASML as part of a plan to accelerate the development of extreme ultraviolet (EUV) lithography and the transition to manufacturing on 450-mm diameter wafers.
ASML put together the equity-plus-research funding program and pledged to make up to 25 percent of the company available to R&D investment partners. ASML went to Intel, Samsung and TSMC first. With TSMC opting to take a 5 percent stake it leaves 5 percent for Samsung or others to take up.
"One of the biggest challenges facing IC scaling today is how to effectively control the escalating wafer manufacturing cost," said Shang-yi Chiang, TSMC's co-COO, in a statement. "We are confident that the additional funding for ASML's research and development programs will help secure and accelerate EUV development activities, in parallel with the necessary focus on improved performance of existing optical lithography tools and speed up the deployment of new technologies for 450-millimeter wafers. This effort will help the industry control wafer cost, and therefore protect the economic viability of Moore’s Law."
"These technologies will benefit the entire industry and are not restricted to our co-investment partners," said Eric Meurice, CEO of ASML, in the same statement.
Do head-up displays lead the wrong way to safety?
June 30, 2015
In vehicles, head-up displays (HUDs) have been developed to reduce driver distraction and help drivers to keep their eyes ...
ZF sets course to driver assistance
Advanced packaging to boost photolithography market, says Yole
Nanogenerator harvests energy from rolling tires
Tactical panoramic video ball creeps in
Conductive ink turns textiles into stretchable electronics
June 29, 2015
University of Tokyo researchers have developed an ink that can be printed on textiles in a single step to form highly conductive ...
Apple Watch tear down reveals European chips
GlobalFoundries’ FD-SOI revolution
Exploring through-wall presence detection
- The 400XAC Series: Two Major Advantages that Simplify Functional Testing
- A Smart Way to Drive ECU Consolidation
- Autonomous Driving: An Eye on the Road Ahead
- Getting Security Right in Wireless Sensor Networks
InterviewCEO interview: Cadence is about enablement, collaboration
EDA companies are being asked to provide expertise from the circuit- to the system-level observes Lip-Bu Tan, CEO of EDA software vendor Cadence Design Systems Inc. Covering such a breadth of endeavour ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Future Electronics has 20 of Intersil's ISL8203MEVAL2Z evaluation boards to give away to EETimes Europe's readers. Worth 95 US dollars, the board was designed to demonstrate the performance of the ISL8203M dual step-down power module which integrates a PWM controller, synchronous switching MOSFETs, inductors, and passives all in a 9.0x6.5x1.83mm package.
The ISL8203M is rated for...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.