TSMC's R&D chief sees 10 years of scaling
October 26, 2011 // DylanMcGrath
The path is clear for continued semiconductor scaling using FinFETs for the next decade, down to the 7-nm node, according to Shang-Yi Chiang, senior vice president of R&D at foundry giant Taiwan Semiconductor Manufacturing Co.
Beyond 7-nm, the most pressing challenges to continued scaling will come from economics, not technology, Chiang said in a keynote address at the ARM TechCon event.
Chiang said he has faith that the semiconductor industry will solve technical hurdles associated with moving past 7-nm over the next decade, but acknowledged that the new technologies might make volume manufacturing of chips with critical dimensions smaller than 7-nm cost prohibitive.
"From node to node, we have found the wafer price has increased much more than previous nodes," Chiang said.
In another ARM TechCon keynote later, Chi-Ping Hsu, senior vice president of R&D at in EDA vendor Cadence Design Systems' Silicon Realization Group, presented data on dramatic cost increases associated with moving from the 32/28-nm node to the 22/20-nm node. The amount of money invested by the semiconductor industry in process R&D, for instance, jumped from $1.2 billion at 32/28 to between $2.1 billion and $3 billion at 22/20, Hsu said. Design costs for a chip jump from $50 million to $90 million at 32-nm to $120 million to $500 million at 22-nm, Hsu said.
At the 32-nm node, a chip needs to sell about 30 to 40 million units to recoup the costs associated with it, Hsu said. At the 20-nm node, the "breakeven" point jumps to between 60 and 100 million units, Hsu said.
FinFETs are three-dimensional transistors in the early stages of being adopted by chip makers. Intel Corp., which refers to its 3-D transistor technology as "tri-gate," is expected to begin sampling 22-nm chips with 3-D transistors later this year.
Chiang said the 20-nm node will be the last generation at which the semiconductor industry can possibly use a planar transistor. "After that, it will run out of steam," Chiang said.
Are you worth insuring? Wearables to decide
January 30, 2015
At Cicor's first Innovation Insights Symposium held in Zurich end of January, the focus was very much on smart wearables ...
Security flaw in BMW's ConnectedDrive detected
Quantum entanglement now on-a-chip
Single crystal perovskites promise cheaper solar cells and LEDs
Wafer-scale perovskite solar cells on the horizon
Spread Spectrum Frequency Modulation Reduces Automotive LED Driver EMI
January 30, 2015
The large number of electronics in an automobile must have reasonably low electromagnetic interference (EMI) in order to ...
Privately-owned car not on the red list, study says
Private equity buys Canadian MEMS foundry
Tronics launches IPO
- Accelerate SDN and NFV with Off-the-Shelf Software
- Sensing Elements for Current Measurements
- Investigating Die attach Failure in IGBTs using Power Cycling Tests
- Power Semiconductor Failure Diagnosis using Thermal Characterization and Power Cycling
InterviewCEO interview: Bosch's IoT startup is all about the system
Thorsten Mueller, CEO of Bosch Connected Devices and Solutions GmbH (Reutlingen, Germany), has been guiding the latest startup subsidiary of Robert Bosch GmbH since 2013 when he started the initiative ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
To ensure you have a good start in 2015, Freescale is giving away five of its QorIQ TWR-LS1021A Tower system modules, worth USD269 each, for EETimes Europe's readers to win.
The module is the most feature-rich and high-performance Tower system offered by Freescale, enabling compatibility and interoperability with the growing list of Tower expansion modules, offering an easily accessible...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.