Two-chip modem consumes half the power of existing HSPA+ 21 Mbps solutions
October 06, 2010 // Jean-Pierre Joosting
ST-Ericsson has launched a power-efficient and compact HSPA+ modem capable of transmitting data at speeds of up to 21 Mbps. With up to fifty per cent lower power consumption than competing HSPA+ 21 Mbps modems available on the market, the highly-integrated M5730 will enable engineers to produce small, affordable and power-efficient HSPA+ smartphones, USB-dongles and embedded modules.
Mobile devices equipped with the M5730 modem, which is already being sampled by customers, will be able to offer up to double the high-speed Internet browsing time of mobile devices using other HSPA+ 21Mbps modems.
According to Magnus Hansson, Senior Vice President and head of the LTE and 3G Modem Solutions division at ST-Ericsson, "We anticipate seeing smartphones and other connected devices based on our new HSPA+ modem shipping in early 2011, enabling consumers and business people to spend more time surfing the Internet at high-speeds and less time worrying about power adaptors and sockets."
ST-Ericsson's M5730 claims to be the first two-chip 21 Mbps modem and the smallest HSPA+ 21 Mbps solution to date. Using just two chips makes the M5730 very compact, reducing the bill of materials for device manufacturers. It also has exceptionally low-levels of heat dissipation enabling it to be embedded in a very wide range of devices.
The M5730 makes use of the 64-QAM advanced modulation technique, providing end-users with higher average throughput speeds and enabling mobile operators to make more efficient use of their spectrum. ST-Ericsson's field tests with mobile operators found the use of 64-QAM technology results in an average 30 percent increase in spectral efficiency.
Recently, the Global mobile Suppliers Association (the GSA) reported that 73 HSPA+ networks are currently up and running and 127 operators in 59 countries have committed to HSPA+ network deployments. Devices based on the M5730 can be rolled out quickly, as it uses the same modem protocol software as the M570 HSPA+ 21Mbps platform which has passed several major American, Asian and European mobile operator IOT tests.
For further information: www.stericsson.com.
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Internet of Things (IoT) manufacturer Ciseco has launched the Raspberry Pi ‘Wireless Inventors Kit’ (RasWIK), featuring 88 pieces to provide everything a Pi owner needs to follow a series of step-by-step projects or to create their own wireless devices, without the need for configuration or even writing code.
RasWIK has been designed to be highly accessible, demystifying the dark art of wireless and enabling anyone with basic computing skills to begin building wireless devices with a Raspberry Pi. You can create anything from a simple traffic light, to a battery monitor, or even a temperature gauge that sends data to the Xively IoT cloud so billions can access the data.This month, Ciseco is giving away twelve Raspberry Pi Wireless Inventors kits, worth £49.99 each for EETimes Europe's readers to win.
And the winners are...
In our previous reader offer, Farsens was giving away five kits for EEtimes Europe readers to evaluate its FenixVortex, Kineo and X1 wireless, battery free sensor tags.
Lucky winners include Mr A. Neil from the UK, Mr. E. Delvaux from Belgium, Mr Lengal from the Czech Republic, Mr H. Bijlsma from the Netherlands, and Mr G. Pfaff from Germany. All should be receiving their packages soon. Lets wish them some interesting findings with their projects.
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