Ultra-flat package Schottky rectifiers handle currents up to 1.5-A
February 03, 2012 // Paul Buckley
NXP Semiconductors is claiming a major new benchmark in miniaturization with the launch of the company’s next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package claims to be the smallest on the market that is capable of carrying a current of up to 1.5 A.
The DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20 V types optimized for low forward voltage and three 40 V types optimized for low reverse current. Average forward current ranges between 0.5 and 1.5 A.
In addition to offering space-saving options, NXP’s new Schottky rectifiers also deliver industry-leading power performance due to a huge heatsink at the package bottom. The low forward voltage of these Schottky diodes reduces power consumption and thereby enables longer battery life in mobile devices. Typical applications include battery charging, display backlighting, switched-mode power supply (SMPS) and DC to DC conversion for small portable equipment. With the 1.5 A types, these can be extended to larger devices such as tablet PCs.
The rectifiers in DFN1608D-2 are also attractive to manufacturers because of the package’s side pads, which are tin-plated to protect against oxidation and allow side solderability. Unlike other leadless solutions where the soldered contacts remain hidden under the package, the side pads help avoid package tilting on the PCB, making it even flatter and maximizing stack density. The ability to solder the package at the side also enables easy visual inspection of the contact. By eliminating the need to inspect the solder contacts with expensive and complex x-ray equipment, the DFN1608D-2 makes the manufacturing process more cost-effective.
For further information: www.nxp.com.
Design win; IDT meets IKEA
April 24, 2015
Integrated Device Technology, Inc. (IDT) has disclosed that IKEA has chosen IDT’s wireless power transmitters to embed in ...
Eurotech to offload its cloud offering to iNebula
Electric vehicles: Driving range decides
Samsung details its flex display
3D-printing aerogels for energy storage
Gartner lowers 2015 chip market growth forecast
April 23, 2015
A mix of currency shifts, excess inventory and the end a PC upgrade cycle is set to slow growth in the global semiconductor ...
Hexagon, Xylon join forces for smart CT-based quality control systems
PSA, IBM tie Connected Car to the Internet of Things
Disposable sensor patch analyses golfers' swing
- Smart Capacitive Design Tips
- Wireless MCUs and IoT
- Battery Management System Tutorial
- Deciding if Automated Test is right for your Company
InterviewInfineon: CAN FD success goes at the expense of FlexRay
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay. ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, DecaWave is offering EETimes Europe's readers the chance to win two TREK1000 kits to evaluate its Ultra-Wideband (UWB) indoor location and communication DW1000 chip in different real-time location system topologies.
Worth €947, the kit allow designers to prove a concept within hours and have a prototype ready in days. Based on the two-way ranging scheme, the kit lets you test...MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.