Ultra-flat package Schottky rectifiers handle currents up to 1.5-A
February 03, 2012 // Paul Buckley
NXP Semiconductors is claiming a major new benchmark in miniaturization with the launch of the companyís next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package claims to be the smallest on the market that is capable of carrying a current of up to 1.5 A.
The DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20 V types optimized for low forward voltage and three 40 V types optimized for low reverse current. Average forward current ranges between 0.5 and 1.5 A.
In addition to offering space-saving options, NXP’s new Schottky rectifiers also deliver industry-leading power performance due to a huge heatsink at the package bottom. The low forward voltage of these Schottky diodes reduces power consumption and thereby enables longer battery life in mobile devices. Typical applications include battery charging, display backlighting, switched-mode power supply (SMPS) and DC to DC conversion for small portable equipment. With the 1.5 A types, these can be extended to larger devices such as tablet PCs.
The rectifiers in DFN1608D-2 are also attractive to manufacturers because of the package’s side pads, which are tin-plated to protect against oxidation and allow side solderability. Unlike other leadless solutions where the soldered contacts remain hidden under the package, the side pads help avoid package tilting on the PCB, making it even flatter and maximizing stack density. The ability to solder the package at the side also enables easy visual inspection of the contact. By eliminating the need to inspect the solder contacts with expensive and complex x-ray equipment, the DFN1608D-2 makes the manufacturing process more cost-effective.
For further information: www.nxp.com.
First color-tunable graphene-based LED is demonstrated
July 29, 2015
Researchers at Tsinghua University in Beijing have demonstrated an LED that can be tuned to emit different colors of light ...
Qualcomm enables wireless charging for mobile devices with metal cases
Intel, Micron launch "bulk-switching" ReRAM
Demand for radar systems boosts Infineonís chip production
'Test city' opens for autonomous cars
AMS buys environmental sensor business from NXP
July 28, 2015
AMS AG has acquired an environmental sensor business unit from NXP Semiconductors NV for an undisclosed amount of money. ...
MEMS force sensor in a chip-scale package begins sampling
World first: Samsung monitor integrates inbuilt wireless charging
Breakthrough for really cost-efficient fuel cells in sight?
- Test environment for the positioning elements of wearable devices
- Automotive Circuit Protection using Littelfuse Automotive TVS Diodes
- Top 5 Challenges for testing Today's Consumer Electronics
- Critical Requirements in High Speed Signal Generation Applications
InterviewGlobalfoundries' CEO on why FD-SOI and why now
With its latest news Globalfoundries Inc. has not only confirmed itself as a supporter of the fully-depleted silicon-on-insulator (FD-SOI) approach to IC manufacturing but that it also thinks sufficiently ...
Filter WizardCheck out the Filter Wizard Series of articles by Filter Guru Kendall Castor-Perry which provide invaluable practical Analog Design guidelines.
Linear video channel
READER OFFERRead more
This month, Novelda is giving away two full XeThru Inspiration kits worth 1499 US Dollars each, for EETimes Europe's readers to experiment first hand with its XeThru technology.Based on the use of radio waves, rather than infrared, ultrasound or light, the company's X2M1000 Inspiration modules can detect presence just from the chest movement while breathing, and measure both the rate and... MORE INFO AND LAST MONTH' WINNERS...
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.