Ultra-slim NFC tags, stickers and labels, less than 0.6mm thick
June 22, 2012 // Julien Happich
SES RFID Solutions is expanding into the rapidly expanding Near Field Communication (NFC) market with the Mobile Phone Sticker family of NFC stickers, less than 0.6mm thick.
Using the company's patented flat inlay technology with high quality copper wound antennas, the flexible tags, cards and sheets are also available with a pre-punch card option for smart phones and inkjet printable labels. The Mobile Phone Sticker family is specifically designed to allow current mobile phone users to use NFC services. The self-adhesive stickers are available in three standard formats, 48x25, 44x22 and 28x19mm respectively and can be delivered with all standard NFC and ISO 14443 chips. The integrated ferrite shield layer ensures communication between the sticker and a NFC reader system even when placed on metallic surfaces or directly on a mobile phone battery. Optional services include custom sizes, full colour printing and chip programming/personalisation.
For customers wishing to personalise the mobile sticker on standard ISO card size printers, SES RFID Solutions offers the Pre-punch NFC Card Series (TIC-XX). After programming and printing the mobile sticker is broken off from the ISO card body and attached to the mobile phone. This option allows users to complete low volume and individual personalisation on standard card equipment. The NFC-Ink Jet Printable Label Series XX SCIP labels are delivered in a 3x3 layout on an A4 size sheet. The self adhesive labels can be printed using common office ink jet and laser printers. Options include a 3x3 or 6x6 layout and chip programming.
Visit SES RFID Solutions at www.sesrfid.com
-
Technology News
Wide-angle lens is less than 3mm high for the same diameter
May 23, 2013
By employing plastic, glass, and hybrid materials in production, Suyin Optronics is able to develop different lenses for ...
-
Technology News
Low-power wireless projected to make waves in remote controls according to IMS Research
-
Technology News
Intel pushes for more research beyond 10-nm
-
Technology News
Expanded ecosystem of ultra-low power MCUs speeds capacitive touch design development
-
Feature Articles
The quick way to build better embedded user interfaces
-
Technology News
ProximusDA teams with STMicroelectronics to develop distributed SOC TLM virtual prototypes
May 23, 2013
ProximusDA GmbH, a company based in Munich, Germany, has collaborated with STMicroelectronics to develop the next generation ...
-
Technology News
Lithium-ion batteries withstand 10.000 charging cycles
-
Technology News
Microsemi begins shipping production-qualified SmartFusion2 SoC FPGAs
-
Market News
Market researcher sees Samsung and Osram in price war
Technical papers
Filter Wizard
Linear video channel
READER OFFER
Read more
The development platform for i.MX 6Quad from element14 (built to the Freescale SABRE Lite design) is an evaluation platform featuring the powerful i.MX 6Q, a multimedia application processor with Quad ARM Cortex-A9 cores at 1.2 GHz from Freescale Semiconductor.
This month, Freescale and element14 are giving away five such platforms, worth £128.06 each, for EETimes Europe's readers to win. The platform helps evaluate the rich set of peripherals and includes a 10/100/Gb Ethernet port, SATA-II, HDMI v1.4, LVDS, parallel RGB interface, touch screen interface, analog headphone/microphone, micro TF and SD card interface, USB, serial port, JTAG, camera interface, and input keys for Android.
And the winners are...
In our previous reader offer, Pico Technology was giving away one of its recently launched PicoScope 3207B, a 2-channel USB 3.0 oscilloscope worth 1451 Euros. Lucky winner Mr L. Sanchez-Gonzalez from Spain should be receiving his PicoScope 3207B soon. Let's wish them some interesting findings with his projects.
Read more
Design centers
Automotive
December 15, 2011 | Texas instruments | 222901974
Unique Ser/Des technology supports encrypted video and audio content with full duplex bi-directional control channel over a single wire interface.
Wide-angle lens is less than 3mm high for the same diameter
Low-power wireless projected to make waves in remote controls according to IMS Research
Intel pushes for more research beyond 10-nm
Expanded ecosystem of ultra-low power MCUs speeds capacitive touch design development
The quick way to build better embedded user interfaces
ProximusDA teams with STMicroelectronics to develop distributed SOC TLM virtual prototypes
Lithium-ion batteries withstand 10.000 charging cycles
Microsemi begins shipping production-qualified SmartFusion2 SoC FPGAs
Market researcher sees Samsung and Osram in price war
EPC offers GaN power library online
Cockpit concept learns driver's habits
Automotive MCU benchmark takes energy efficiency into account
Industry's first ultra-wideband Doherty amplifiers support broadband operation
Graphics chip recognizes nearby pedestrians and bicycles 

Follow us