SEMI European 3D Summit - Grenoble

23 Jan 2017
25 Jan 2017
From the 23rd to the 25th of January will take place the 5th edition of SEMI European 3D Summit in Grenoble, exploring a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges.

Also on the agenda will be talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, and 3D alterna-tive technologies in order to create Heterogeneous Integration and High Density Systems for different applications.
Reputable keynote and invited speakers will present their choices and strategies among the 3D Integration technologies pallet, giving particular attention to current adoption for applications such as high-end memories, performance applications, mobile, imaging and automotive.

As in previous 3D Summit editions, SEMI intends to highlight the latest business challenges and opportunities in the 3D sector by kicking off the summit with a market briefing. At the market briefing, attendees will hear from several 3D and packaging industry experts who will present their exclusive business & market insights and reverse engineering analysis confirming the huge growth of advanced packaging as forecasted.

More information and registration at www.semi.org/eu/european-3d-summit-2017