25gbps on copper for industrial automation

February 22, 2017 // By Julien Happich
Erni continues to expand its connector product offering to meet the growing demands of industrial control networks and motion control/drive systems. The company suggests its miniature MicroSpeed connector system, the high-performance SMC Series, and the newest MicroCon family of connectors to combine signal density, electrical performance, and mechanical dependability in smaller package sizes.

The miniature MicroSpeed SMT modular connector system has a 1mm pitch and supports high-speed data applications up to 25Gbps. Offering exceptional signal integrity, the shielded connectors are suitable for existing and next generation communication protocols. Board-to-board stack heights between 5mm and 20mm can be achieved at effectively any desired height (due to a long 1.5mm contact wipe length). Low inductance shielding effectiveness enables noise sensitive designs to be realized without adding costly shields within the enclosure. Featuring a flexible open pinfield design, the MicroSpeed offers several different signal-pair layouts for differential data transmission when required.

The SMC line features a number of different pincounts, heights and configurations in a 1.27mm grid to meet a variety of application requirements. Offering secure data transmission rates up to 3Gbps and current carrying capacity of 1.7A per contact, the compact SMC is ideal for applications with limited space. Like MicroSpeed, the SMC family also offers a dual-beam mating interface and long contact wipe length for rugged and proven reliability on the factory floor.

The Erni MicroCon 0.8mm pitch product family is the newest release and design based on the proven contacts in both MicroSpeed and SMC, but further enhanced by offering this reliable two-sided female contact (dual beam) in a dense 0.8mm pitch offering. Vertical solutions for board-to-board stacking and new extensions for perpendicular applications (midplane/backplane) will make this new product family an optimal choice for board space savings applications in a reliable/rugged interface.
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