6SigmaET thermal simulation tool: release 10

June 21, 2016 // By Julien Happich
Engineering Simulation software developer Future Facilities has announced Release 10 of its 6SigmaET electronics thermal simulation software, introducing a host of new features designed to accelerate solve times, enhance accuracy and enable the creation of more complex designs.

At the heart of Release 10 lies an improved unstructured gridding capability which makes solving up to six times faster by altering the granularity of its grids to account for varying levels of complexity in the model.

This allows users to run more variations of their designs, large models with greater accuracy and in ever-shorter timeframes.

The tool makes key thermal analysis tasks even simpler, with improved configuration of the simulation environment including altitude and solar radiation. 6SigmaET now also calculates the weight of each part so engineers can easily optimise their product to reduce weight. Through these enhancements, engineers can use 6SigmaET to develop designs for an even greater array of real-life and hypothetical scenarios, without the need for costly prototypes.

Other features include a new in-built Package Builder, which allows users to automatically generate individual IC component models simply by defining a list of pre-set parameters. Through this interface, users can create detailed integrated circuits thermal models for inclusion within their product designs – allowing them to analyse internal temperatures of complex ICs. 

The tool also takes advantage of 6SigmaET’s new partnership with cloud platform Rescale, allowing simulations to be solved on demand via high performance computing in the cloud.

Visit Future Facilities at www.6sigmaet.info