Bluetooth Smart module requires no RF design expertise to use

July 21, 2014 // By Graham Prophet
Based on the Nordic Semiconductor nRF51822 SoC, the LG 4403 Bluetooth Smart system-in-package (SiP) module measures 5.3 x 4.7 x 1.0 mm and so is small enough to fit into any current or next generation smartphone, tablet, or computer appcessory or sensor.

LG Innotek has developed a Nordic nRF51822 SoC-based Bluetooth Smart (previously known as Bluetooth low energy) module that carries little or no size penalty compared to a discrete design. The LG 4403 module includes, in addition to the Nordic Semiconductor nRF51822 and its 32-bit ARM Cortex M0 microprocessor, 256 kB of Flash memory, and full range of analogue and digital peripherals (including GPIO, ADC, SPI, I2C and UART): a 32 MHz high stability X-Tal quartz oscillator, fully-matched RF matching circuit, 19 GPIOs (general purpose input/outputs), and can run from 1.8 to 3.6V power source.

Power consumption is also optimised for ultra low power operation with a claimed typical performance of 10.5 mA for transmission, 13 mA for reception, and 0.6 µA for deep sleep 'off' mode. Rx sensitivity is quoted at -93 dBm at 1 Mbps data transfer rates, and TX power -20 up to +4 dBm.

"LG Innotek has a long history in module development stretching all the way back to TV tuners in the 1970s and more recently variable connectivity modules such as Wi-Fi, Bluetooth, and LTE for the mobile, TV, and automotive industries," explains Mr. Kwangjae Park, Senior Research Engineer for LG Innotek. "But because we are also an electronics component manufacturer, we used that expertise to achieve extreme levels of miniaturization and integration in our modules that developers would often struggle to match even if designing with separate discrete components."

LG Innotek; www.lginnotek.com
Nordic Semiconductor; www.nordicsemi.com