Co-verification solution supports InFO packaging

March 14, 2016 // By Julien Happich
Mentor Graphics has announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology.

The solution comprises the Calibre nmDRC physical verification product, the Calibre RVE results viewing platform, and the Xpedition Package Integrator flow. It enables mutual customers to deploy the unique fan-out layer structures and interconnects in the TSMC InFO technology, targeting cost-sensitive applications such as mobile and consumer products. The Mentor solution allows IC and package designers to view and cross-probe results from the Calibre nmDRC tool directly inside the Xpedition Package Integrator flow for verification of TSMC InFO interconnect structures. Because this flow is based on proven integration via the Calibre RVE tool, it results in automated sign-off verification and easier correction of any issues highlighted by the Calibre nmDRC product. It also streamlines the addition of future features and capabilities.
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