Modules complying with these standards are already in development and will be announced in time with the launch of the next processor generations.
The company will make available SMARC 2.0 modules for the full range of relevant processor technologies – from the Intel Atom processor to various ARM designs, while continuing support for all current low-power processors for Qseven 2.1 designs.
The essential difference between the two standards is the number of supported interfaces with Qseven providing up to 230, and SMARC 2.0 up to 314 pins. SMARC is intended to interface richer systems with the smallest footprints; while Qseven is suitable for slimmer and less complex module and carrier board designs.
COM Express 3.0 will primarily offer a new pinout type specifically for Server-on-Modules. The server-focused Intel Xeon and Intel Core processors as well as the AMD Embedded R-Series processors are prime targets, with ARM based platforms another possible option.
“All new specifications provide developers with support for the latest interfaces and many detail improvements. Next to the all-new SMARC 2.0 for highly compact multifunction systems, the new COM Express pinout for Server-on-Modules is particularly innovative. It enables us to target the new markets for decentralized, real-time edge servers that are used in media streaming as well as IoT, M2M, medical and automation applications,” explained Martin Danzer, product director at congatec.
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