DRIE for hard materials extends deep MEMS

October 07, 2016 // By Peter Clarke
Semiconductor manufacturing equipment supplier Corial SAS (Bernin, France) has announced a deep reactive ion etch (DRIE) process for hard materials used in MEMS based on its 200mm equipment.

Deep etching of silicon, achieved via the Bosch process or via cryogenic microfabrication technologies, is routinely used for MEMS manufacturing to create deep microstructures with high aspect ratios.

Increasingly harder materials such as glass, quartz, silicon carbide and lithium tantalate are gaining interest for MEMS either because of special properties or for reduced costs although it brings challenges over speed of etch and damage-free production.

"We have upgraded our ICP-RIE equipment with features such as high power (2kW) ICP source, high power (1kW) RF bias supply, retractable quartz liner to protect the reactor walls, higher capacity turbo pump, or optimized system for wafer cooling," said Elsa Bernard-Moulin, marketing manager at Corial, in a statement.

The equipment can achieve depths of more than 100-micron.

Contracted customers can gain access to the technology through system upgrades Bernard-Moulin, said.

Corial will be exhibiting at Semicon Europa 2016, October 25 to 27 in Grenoble, France.

Related links and articles:

www.corial.net

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