Engineering plastics for electronic systems with environmental constraints

June 21, 2013 // By Graham Prophet
DSM Engineering Plastics has announced a broad portfolio of halogen-free materials for electronics and electrical applications to meet growing regulatory demands and OEM requests related to the elimination of substances of hazardous concern.

Producers of key electronic components, such as connectors, sockets, wire & cables, low voltage switch gear devices and, more specifically, enclosures of MCB, MCCB and other Industrial Control Gear devices and LED lighting, are looking to advance miniaturisation, system cost reduction and integration of components. This requires materials with higher mechanical, thermal and processing performance over conventional halogen-free high temperature polyamide materials, such as higher temperature performance and flow, thin-wall strength, high reflectivity and Glow Wire Ignition Temperature (GWIT) at end use part level.

The range includes:

Arnitel XG thermoplastic copolyester (TPC) is the alternative for PVC in DC and AC power cables as well as data cables such as USB (Universal Serial Bus) or HDMI (High Definition Multimedia Interface). Like other Arnitel grades it is halogen free and free of restricted materials and plasticisers (unlike PVC) – nor does it release carcinogenic compounds into the environment during its manufacturing, use and disposal. It is both EU and UL compliant, and offers excellent mechanical and chemical properties.

Stanyl, Stanyl ForTii, Akulon and Novamid are well-established materials for the electronics market. From connectors and sockets in consumer electronics, appliances or industrial applications to various components such as switches, relays, and bobbins, DSM offers performance materials - all entirely free of halogen and red phosphorous.

For DDR connectors, Stanyl and Stanyl ForTii both have excellent warpage and thin retention characteristics and are used by the majority of OEMs and ODMs in desktops and servers.

Stanyl and Stanyl ForTii both excel in connector applications like SATA (Serial ATA) and SAS (Serial Attached SCSI) connectors, FCP (Printed Circuit Board) connectors and Memory card connectors. Most smartphones, tablets, TVs or notebooks in the market today use these materials, which have been developed to retain high stiffness, even at elevated lead-free reflow assembly temperatures, drastically reducing warpage to minimise rejects.

In appliance and industrial applications, Stanyl ForTii is increasingly being recognised by leading manufacturers as a