ESD protection chips targets high-speed signal lines

September 07, 2012 // By Julien Happich
NXP Semiconductors has expanded its range of circuit protection devices with chips featuring a high ESD robustness exceeding IEC61000-4-2 level 4 on system level.

The companys' ESD protection portfolio now includes 15 devices for protecting high-speed signal lines such as HDMI, MHL, MIPI, DisplayPort, eSATA, Thunderbolt, USB 3.0/2.0 and Ethernet. The latest additions to NXP's ESD protection portfolio feature deep snapback combined with very low dynamic resistance. Highly sensitive to ESD pulses, the latest system-on-chips (SoCs) for ultra-high-speed data lines require system-level circuit protection up to 10 kV (IEC61000-4-2), as well as extra support for signal integrity. The NXP IP4294CZ10-TBR and IP4369CX4 are designed to protect even the most sensitive high-speed interfaces: They offer a unique blend of deep snapback (2.95 V typ at 1A) and a very low dynamic resistance of only 0.4 Ohm and 0.2 Ohm, respectively.

NXP also provides low clamping parts without snapback for universal use, including applications connected to DC current sources with high current limits, such as Vbus. These include uni- and bi-directional ESD protection devices up to 5 lines such as PESD5V0X1BCL, PESD5V0X1BCAL, PESD5V0F5UV or the PESD5V0X1U family. These devices offer best-in-class overshoot and clamping voltages (of 7.5 V after 30 ns for an 8 kV ESD pulse, in compliance with IEC61000-4-2) and ultra-low capacitance down to 0.49 pF (typ).

Package options include very small and thin plastic SMD and WLCSP down to the 0603 form factor ( DSN0603-2, 0201 inch). Other options include NXP’s leadless solderable side pads package, which enables visual inspection and provides very robust soldering ( DFN1006D-2).

Visit NXP Semiconductors at www.nxp.com/circuit-protection