Kandou SerDes capable of 1Tbit/s

December 11, 2015 // By Peter Clarke
The Glasswing SerDes core in development at startup Kandou Bus SA (Lausanne, Switzerland) has been tested and demonstrated the "capability of achieving" 1Tbit/s chip-to-chip at less than 1W of power consumed.

Kandou’s technology is based on signaling method called Chord Signaling in which correlated signals are sent across multiple wires. The version of Chord Signaling employed in Glasswing, CNRZ-5 coding, delivers 5 bits over 6 wires for a total bandwidth of 125Gbps. The link achieves a BER of <10^-15 at the targeted data rate of 25GBaud and can support channels up to 12mm in length (die-to- die insertion loss up to 6dB) at full rate and 24mm at half rate.

 

The link has also proven to be robust under stress including overclocking up to 30GBaud, temperature testing from 0° to 100°C, and running full rate up to 24mm. Measured power for a single instantiation of the link is 1.1pJ/bit and in a quad configuration would drop to 0.97pJ/bit.

Through the use of a bi-directional version of Glass wing 2Tbps of bandwidth can be achieved using only 320 signal pins and standard bump pitches, the company said.

"System architects are increasingly interested in 2.5D integration for flexibility, faster time to market, improved performance and lower power ," said Amin Shokrollahi, Kandou founder and CEO. " Our Glasswing link, which is optimized for chip-to-chip interconnect inside a package, allows customers to achieve both high bandwidth and low power and truly realizes the potential of 2.5D packaged solutions. "

The Glasswing link IP is delivered as a hard IP and licensed customers receive: data sheet and application notes, channel compliance guidelines, standard integration views (GDS, LEF, verilog, .lib), production test support, Spice models and Kandou proprietary KEYE and TAU modelling tools. 

Kandou is a 2011 spinoff from Ecole Polytechnic Federale de Lausanne (EPFL).

Related links and articles:

www.kandou.com

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