LED modules pack multiple CSPs with colour tunability

October 13, 2016 // By Julien Happich
Samsung Electronics has announced a line-up of chip scale package (CSP) LED modules for spotlights and downlights. The combination of advanced flip chip and phosphor coating technology eliminates metal wires and plastic molds to enable more compact designs when manufacturing LED modules and fixtures.

Delivered in either 19x19mm or 28x28mm form factors, the CSP LED modules can pack twice the number of LED packages in cool and warm temperature while remaining compact, allowing for the creation of seamlessly tunable colours. The CSP LED modules are designed following Zhaga specifications. They are offered in diverse beam angle options – spot, medium, wide, they have successfully completed 9,000 hours of LM-80 testing, a level of proven performance that reduces the time to market for lighting manufacturers.

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