The DigRF v4 interface supports HSPA+, LTE, Mobile WiMax, and existing 3GPP standards including 2.5G and 3.5G. DigRF v4 is based on the MIPI Alliance M-PHY physical layer specification. The specification enables a single, integrated Link between a baseband IC and RFICs, with options for additional RFICs and BBICs using separate links.
The RFFE v1.10 specification defines a standardized control architecture for RF front-end devices, and offers an approach for multi-mode, multi-band and multiple antenna configurations. It offers a method for controlling power amplifiers, low-noise amplifiers, filters, switches, power management modules, antenna tuners and sensors. It supports point-to-multipoint connectivity, controlling simple to complex RF systems.
Companies contributing to the development of the DigRF v4 Version 1.10 specification include: Arasan Chip Systems Inc., Cadence Design Systems Inc, Fujitsu, Intel, Motorola Mobility, Nokia, Panasonic, Research In Motion, ST-Ericsson and Synopsys.
Companies contributing to the development of the RFFE v1.10 specification include: Analog Devices, Fujitsu, Nokia, NXP, Panasonic, Peregrine Semiconductor, Qualcomm, RF Micro Devices, Skyworks Solutions, ST-Ericsson, Texas Instruments and WiSpry.
For further information: www.mipi.org.