NXP expands i.MX single chip module technology for rapid prototyping

May 21, 2016 // By Graham Prophet
NXP has introduced a vertical integration technology, V-Link, in which the first announced product is based on the i.MX 6SoloX single chip module (SCM). The V-Link bus allows customers to customize their own system adding connectivity, sensing, and other off-the-shelf solutions on top of the base SCM device through package-on-package assembly technology.

The concept, NXP says, addresses applications where designers need to rapidly prototype and create their own unique product offerings in a very limited space.

The single chip system module portfolio is a highly featured, software-enabled, plug-and-play solution in an extremely small footprint, and it is completely designed and tested, enabling engineers to develop products within six months of sampling. V-Link technology allows users to apply the design acceleration that SCM provides along with the customization capabilities of the V-link bus.

Integrated within the base SCM-i.MX 6SoloX V-Link device is low-power memory and a full Power Management IC (PMIC). The SCM-i.MX 6SoloX V-Link is recommended for consumer and industrial customers building compact and low-power portable products in need of connectivity, security, sensing, and graphical user interfaces. Designers can realize up to 68% PCB area savings using the SCM plus V-Link technology.

 

The SCM portfolio continues to expand with new offerings at the lower-end of the portfolio through the SCM-i.MX 6SoloX, supporting low-power memory via standard package-on-package assembly technology, at a new, lower cost offering access to samples and development boards as well as releasing the first set of industrial parts for SCMs – the SCM-i.MX 6Dual and SCM-i.MX 6Quad. Continuing to reduce the PCB area footprint, SCM devices are now also available with the option to assemble ePoP – eMMC plus LPDDR2 – on top of the base SCM device.