Aimed at circuit designers looking for a simple and inexpensive method of disabling low-voltage power rails, the parts have low on-state resistance (RDS(ON)) under low gate drive conditions. This enables power rails down to 1.5V to be switched with minimal conduction losses. The DMP1022UFDF has an RDS(ON) of <20 mΩ with a -2.5V gate drive, while the DMP2021UFDF achieves <26 mΩ at -1.8V gate drive.
For space-critical applications, the 4 mm² footprint DFN2020 package has an off-board height of 0.6 mm. This package also features an exposed drain pad with a thermal resistance of <10°C/W from junction to pad to assist in extracting heat from the package, reducing die temperature and increasing device reliability.
The DMP1022UFDF is priced at $0.16 (10,000) and the DMP2021UFDF at $0.26 (10,000).