PCB assumes task of heat dissipation

May 11, 2012 // By Christoph Hammerschmidt
An innovative way for the thermal management of high-power LEDs has been demonstrated by Austrian PCM manufacturer Haeusermann GmbH. The approach combines the functions of heat dissipation and current feed.

In order to achieve the goal of heat dissipation, relatively massive copper elements are integrated into conventional FR4 printed circuit boards. These elements can be implemented as copper profiles on top of the conducting layers or as wires. The combination of integrated copper profiles with modern PCB technologies such as microvias and thermovias enables the direct contacting of the solder surfaces of the LEDs or heat sinks to the profiles, effectively reducing bottlenecks in the thermal path. Thus, it facilitates an efficient heat dissipation without isolating layers beneath the LED heat pad.

Haeusermann's proprietary HSMtec PCB technology enables the company to offer a variety of customer-specific features. Examples are integration of intelligent light controls on-board at no extra costs; flexible light and product design through multi-dimensional PCB designs, or optional dielectric strength of 4kV without additional effort.

HSMtec is manufactured in a standard process in which external copper elements are bonded directly to the basis copper material by means of an ultrasound bonding process. Multilayer designs are possible as well. 

For more information, visit www.haeusermann.at