On the photonics roadmap: chip-to-chip and intra-chip interconnects

July 20, 2012 // By Julien Happich
The CEA-LETI annual review that took place late June was an opportunity to catch up with the state-of-the-art in microsystems and microelectronics.

Among the many lectures running in parallel, my bet was that a whole afternoon session on photonics would fill-up my curiosity on the topic. The different presenters all acknowledged that copper alone would not suffice to match the speed and data density required by future generations of consumer devices, with data streams expected in the TeraFLOPS range.

Read the full article on page 10 of our July/August digital edition.