The pin-in-paste method, also called pin-in-hole or intrusive reflow, is a process that allows through-hole components to be reflow soldered instead of wave soldered. The pin-in-paste option has been added to the Pulse Electronics PulseJack JXR0 and JXR1 1x1 tab down and tab up 100BASE-T integrated connector module (ICM) product families and is being developed for implementation in select Pulse Electronics 1000Base-T ICM families as well. Because the ICM is compatible in a pin-in-paste process, it completely eliminates the need for the added wave soldering process, saving time, increasing throughput, and reducing costs.
A typical production process of electronic printed circuit boards (PCB) consists of a component placement process and soldering of the components to the PCB. When you have both surface mount (SMT) components and through-hole (TH) components you have to process the PCB through both a reflow solder process for the SMT components and a wave soldering process for the TH components. The ICM is often the only TH component on the PCB, so wave soldering would be necessary specifically for that part. The connectors come packaged in tubes or tape and reel.
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