Power Integrated Module targets automotive BLDC systems

July 27, 2016 // By Christoph Hammerschmidt
One of the most significant trends in automotive electronics is electrifying the auxiliary units, replacing mechanic components like hydraulic power steering by electric designs. These electric units always contain a motor and power electronics. For such applications, On Semiconductor now has expanded its portfolio of power integrated modules (PIMs).

The new STK984-190-E module is suitable for use in 12 V automotive electric motor drive applications with power ratings up to 300 W, such as electric pumps, fans and windscreen wipers. It contains six 40 V, 30 A MOSFETs configured as a three-phase bridge with an additional 40 V, 30 A high-side reverse battery protection MOSFET. The latter ones are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with high thermal performance taking up only half of the board space used by an equivalent discrete solution.

Used in combination with motor controllers , such as LV8907UW, designers can build high efficiency BLDC solution with best in class thermal performance, built in diagnostics, and an ultra-small PCB that saves critical size and weight.   

 

Using the module allows both the component count and the bill of materials costs to be reduced substantially. The DBC substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFETs. This reduces power losses and increases reliability due to a reduced change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate.  STK984-190-E has a specified operational temperature range of -40°C to 150°C. The integrated MOSFETs are all AEC-Q101 qualified.

At least 13 to 15 discrete components would typically be needed to develop an effective BLDC drive solution, whereas the STK984-190-E automotive power module needs less than half that. In addition to its compact size, the strong thermal performance of the STK984-190-E allows a smaller heatsink to be employed, the vendor claims.

More information: http://www.onsemi.com