Process monitor ready to embed on TSMC 16FF+

September 01, 2016 // By Julien Happich
Moortec Semiconductor has released an Embedded Process Monitor for TSMC’s 16nm FinFET+ process. The process monitor provides the means for advanced node IC developers to detect the process variation of low-leakage 16nm core digital MOS devices.

The Process Monitor can be used to enable a continuous Dynamic Voltage & Frequency Scaling (DVFS) optimisation system, monitor manufacturing variations on and if required, across chip, gate delay measurements, critical path analysis, critical voltage analysis and also monitor silicon ‘ageing’.

Using such monitors embedded within SoC designs allows for greater dynamic performance optimisation as sensing die temperature, detecting logic speed and monitoring voltage supply levels can be used intelligently to vary system clock frequencies and the voltage levels of supply domains.

A key aspect is that optimisation can be applied to each and every device, either during production or when devices are 'in-the-field', claims Moortec. The company also believes that strategies adopted by IC designers over the coming years will be heavily influenced through the analysis of data harvested from in-chip monitors during the life time of every device. An AMBA APB interface is also available and provides a standard bus interface for a single instance of the process monitor.

Visit Moortec at www.moortec.com

 

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