The ExaMAX header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and exceeds OIF-CEI-28G-LR specifications. Return loss compliance is achieved in both 85Ω and 100Ω systems due to targeting the 92Ω specifications and controlling reflections at all geometry transitions within the connector.
Samtec’s ExaMAX system claims the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stub is minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment.
The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk. The 2.00 mm-pitch, 40-differential-pair design (4 pairs x 10 columns) and the 72-differential-pair design (6 pairs x 12 columns) are now available. A 3.00 mm-column-pitch design for 56 Gbps performance is in development.