SEMI announces speaker line up for MEMS summit

May 29, 2016 // By Peter Clarke
SEMI has announced a preliminary line up of speakers for its second European MEMS Summit being helf in Stuttgart on September 15 and 16, 2016.
  • Amkor  - A. Arcedera, VP MEMS
  • Bosch Automotive - J. Stadler, SVP & Head of Sensors
  • Bosch Sensortec - U. Gomez, CTO
  • Globalfoundries - R. Kumar, Senior Director MEMS
  • IHS  - J. Bouchaud, Director and Senior Principal Analyst MEMS & Sensors
  • Intel - R. Baskaran, Senior Technologist
  • Qorvo - R. Aigner, Senior Director R&D Acoustic Technology
  • NXP Semiconductors - J. Weyer, VP Automotive Sales EMEA
  • Roland Berger GmbH - Michael Alexander, Partner
  • STMicroelectronics - B. Vigna, EVP GM, Analog and MEMS Group
  • STMicroelectronics - A Onetti, GM Volume MEMS & Analog Division
  • Teledyne DALSA - C. Jean, EVP & GM Foundry Operation
  • Yole Developpement - E. Mounier, Senior Analyst MEMS

The conference program is developed by a steering committee composed of executives from ASE, Bosch, Bosch Sensortec, CEA-Leti, EV Group, Fraunhofer ENAS, Fraunhofer IZM, IHS, NXP, Okmetic, Sencio, SPTS, STMicroelectronics, SUSS MicroTec, X-Fab, and Yole Developpement. SEMI is operating a system of "early-bird" registration that is open until May 31.

Related links and articles:

www.semi.org/EuropeanMEMSSummit 

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