Unlike other approaches which focus on the quality of sound produced at the source, HD-PA offers a new and authoritative approach for driving innovation in personal audio at the ear, considering and addressing the influence of important environmental factors, including noise.
As a result of the combination of technologies, which include ST’s best-in-class audio IC’s for sound reproduction and noise cancellation, MEMS microphone sensing and Soundchip’s audio system technology for sound at the ear, the companies plan to deliver HD-PA Platforms and HD-PA Ready components that present an unbeatable combination of performance, reliability and speed to market.
The substantive collaboration announced today will see ST license patented personal audio technology from Soundchip, becoming an active champion of the HD-PA Standard, while Soundchip will access design software tools from ST and promote ST’s HD-PA Ready silicon.
The intellectual property that ST is licensing from Soundchip provides access to a comprehensive set of technological resources that enable ST to deliver to its customers HD-PA-compliant sound performance in IC’s designed for state of the art headsets and headphones.
ST expects its first HD-PA Ready silicon devices to be available in sampling quantities at the beginning of Q4 2011.
Visit Soundchip at www.soundchip.ch.
Visit STMicroelectronics at www.st.com.