The chips feature an ultra-low power radio, integrated ARM Cortex-M3 MCU, sensor controller, low-power modes and 0.6 µA sleep current, as well as a top ULPBench score of 158.
The Flash-based, 4x4mm QFN package eases compact integration. TI provides software options to ease development, with point-to-point communication examples featuring EasyLink and a wM-Bus protocol stack leveraging TI RTOS, as well as a Contiki 6LoWPAN mesh networking stack.
Developers will also have access to development tools, reference designs, online training and E2E community support to help ease their design process. The MCUs come with scalable memory options to fit developer’s code size with 32kB, 64kB, or 128kB Flash. The SimpleLink Sub-1 GHz CC1310 wireless MCUs, for operation in 315 MHz, 433 MHz, 470 MHz, 500 MHz, 868 MHz, 915 MHz and 920 MHz ISM bands, will be available in 4x4, 5x5 and 7x7mm QFN packages.
Visit TI at www.ti.com/simplelink