Thermal conductivity of 7.5W/m-K for silicone-based interface

March 15, 2016 // By Julien Happich
The Therm-a-gap TPS60 thermal interface material developed by Chomerics Europe has been designed for effective heat dissipation in telecommunication, IT and automotive applications.

The sheet material comprises a soft (Shore 00-35) silicone matrix filled with thermally conductive particles. As a result, it demonstrates exceptional conformability similar to a putty-type material. The gap filler enables low thermal contact resistance under low applied pressure, and is targeted at the filling of air voids between PC boards or high temperature components, as well as heatsinks, metal enclosures and chassis. Available in standard thicknesses of 1.0 to 5.0mm, the RoHS-compliant sheet material exhibits a thermal conductivity of 7.5W/m-K at 20psi while being an electrical insulator. It has a specific gravity of 3.26. The product’s conformability in combination with its high thermal conductivity reduces the risk of damaging fragile components and ensures fast heat transfer away from electronic components. A fabric carrier version is also available for improved tear resistance and easy handling.

Visit Chomerics at www.parker.com/chomerics