Tin-lead power modules address defence, avionics applications

June 21, 2016 // By Graham Prophet
Linear Technology (Milpitas, CA) recently announced a series of over 50 µModule (micromodule) power products that it is making available in tin-lead (SnPb) BGA packages. The parts are aimed at sectors where lead-free assembly is not regarded as a completely satisfactory substitution for tin-lead, and where regulatory exemptions exist - primarily defence, avionics and heavy equipment industries.

The SnPb BGA package simplifies PC board assembly for suppliers in these industries by providing:

  • Surface mount vs through-hole PCB assembly.
  • Complete, encapsulated DC/DC regulator circuit in one BGA package vs high component-count, unverified discrete solution.
  • 100% tested point-of-load regulator solutions vs requiring verification and supervision of discrete circuit point-of-load regulator solutions.
  • Simpler cleaning under the µModule BGA package due to higher standoff compared to flat LGA or QFN packages.
  • Reflow temperature identical to the other tin-lead components on the PCB vs higher temperature required for point-of-load regulators with Pb-free solder paste.

µModule power products with SnPb BGA packages are offered in four DC/DC converter categories: (1) step-down or buck converters with single and multiple outputs, (2) buck-boost converters, (3) isolated converters, and (4) converters with PMBus digital telemetry with READ and WRITE data capability.

Lead-free (SAC305) versions of these devices and other µModule products in both BGA and LGA packages are available at www.linear.com/umodule

The tin-lead capability is summarised at; http://lt.linear.com/00w